P_2x4B_082_A

Parts committed by Bolla Gino on date 12/18/2006

PartID
BBMBBM_082-2x4B
VHDI2x4_324

ROCROC waferLabel
ROC0W32_XA4K5NT40B
ROC1W32_XA4K5NT40A
ROC2W32_XA4K5NT58D
ROC3W32_XA4K5NT58B
ROC4W32_XA4K5NT37D
ROC5W32_XA4K5NT38A
ROC6W32_XA4K5NT39A
ROC7W32_XA4K5NT39C

Inspected by Lockwood Gale on date 12/20/2006
LR_dev0.259
LL_dev0.250
FINAL COMMENT by Lockwood GaleBBM is mis-aligned, shifted toward the HDI pads by 0.250 mm w.r.t.ideal location on VHDI. No problem wirebonding.

PLAQUETTE made READY for testing on 12/20/2006 by Lockwood Gale

P_2x4B_082_Aon 12/21/2006 9:52 AM P_2x4B_082_A-1on 12/21/2006 10:07 AM

PLAQUETTE TESTED on 2006-12-21 by Gino Bolla at ROOM temperature before encapsulation

Results at ROOM temperature before encapsulation

PLAQUETTE TESTED on 2006-01-05 by Gino Bolla at -19C before encapsulation

Results at -19C temperature before encapsulation

PLAQUETTE READY FOR ENCAPSULATION

PLAQUETTE encapsulated on 01/05/2007 by Kirk Arndt

P_2x4B_082_A-7on 1/8/2007 10:15 AM

PLAQUETTE TESTED on 2006-01-08 by Gino Bolla at ROOM temperature after encapsulation

Results at ROOM temperature after encapsulation

PLAQUETTE Brought to +60C for one hour and then thermally cycled -20C to +25C 16 times on 2006-01-08 by Gino Bolla

P_2x4B_082_A-8on 1/9/2007 10:33 AM

PLAQUETTE TESTED on 2006-01-09 by Petra Merkel at -20C after encapsulation and thermal cycle

Results at -20C after encapsulation and thermal cycle

P_2x4B_082_A-9on 1/9/2007 11:55 AM P_2x4B_082_A-10on 1/9/2007 11:57 AM P_2x4B_082_A-11on 1/9/2007 11:59 AM P_2x4B_082_A-12on 1/9/2007 2:16 PM P_2x4B_082_A-13on 1/9/2007 2:35 PM

PLAQUETTE TESTED on 2007-01-09 by Petra Merkel

[IMAGE] of
IV_XML-File
Maximum Voltage 430 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 10 V
Operational Voltage 50 V

ROCROC0ROC1ROC2ROC3ROC4ROC5ROC6ROC7
Ibias_DAC110116130144126124112132
Vana136160158172157155151151
Cal_Del7994957885878687
Vthrs_Comp7278758569767885
Unbumped00000000
Dead01000000
Noisy00000000
Undecoded00000000
Total BAD01000000

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

PLAQUETTE READY FOR SHIPPING

PLAQUETTE encapsulated on 1/12/2007 by Bolla Gino

Shipped on date 2007-01-15

Plaquette assigned to panel P3L_023