Parts committed by Bolla Gino on date 11/28/2006
Part | ID |
---|---|
BBM | BBM_041-2x3T |
VHDI | 2x3_202 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | XF4K3JT | 21D |
ROC1 | XF4K3JT | 24D |
ROC2 | XF4K3JT | 22C |
ROC3 | XF4K3JT | 32B |
ROC4 | XF4K3JT | 32A |
ROC5 | XF4K3JT | 31B |
Inspected by Arndt Kirk on date 11/30/2006
LR_dev | 0.028 |
LL_dev | 0.035 |
FINAL COMMENT by Arndt Kirk | No assembly problems. BBM joined to VHDI with "zero" force. Visible ROC bounce during wirebonding, but no problems. All wirebonds look OK. |
PLAQUETTE made READY for testing on 11/30/2006 by Arndt Kirk
PLAQUETTE TESTED on 2006-12-01 by Gino Bolla. Zero Pressure results here.
Repeated hammering of wire bonding pads 9 and 10 on all 6 ROCs, plus subsequent new wire bonding performed.
PLAQUETTE TESTED on 2006-12-06 by Petra Merkel. Hammering excercise results here.
P_2x3T_041_C-3on 12/7/2006 12:18 PM P_2x3T_041_C-4on 12/7/2006 12:37 PM P_2x3T_041_C-5on 12/8/2006 11:16 AM P_2x3T_041_C-6on 12/8/2006 11:37 AM
PLAQUETTE TESTED on 2006-12-08 by Petra Merkel
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | |
Ibias_DAC | 128 | 125 | 127 | 127 | 157 | 135 | |
Vana | 117 | 135 | 127 | 122 | 131 | 125 | |
Cal_Del | 92 | 85 | 82 | 90 | 71 | 85 | |
Vthrs_Comp | 80 | 68 | 83 | 65 | 75 | 72 | |
Unbumped | 590 | 68 | 17 | 4 | 13 | 57 | |
Dead | 0 | 0 | 0 | 0 | 0 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 95 | 0 | 0 | 0 | |
Total BAD | 590 | 68 | 112 | 4 | 13 | 57 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
PLAQUETTE READY FOR SHIPPING