P_2x3B_133_C

Parts committed by Bolla Gino on date 1/25/2007

PartID
BBMBBM_133-2x3B
VHDI2x3_416

ROCROC waferLabel
ROC0XE4KFET31D
ROC1XE4KFET23D
ROC2XE4KFET24C
ROC3XE4KFET26A
ROC4XE4KFET26B
ROC5XE4KFET28B

Inspected by Arndt Kirk on date 1/30/2007
LR_dev0.084
LL_dev0.108
FINAL COMMENT by Arndt KirkNo_assembly_problems No wirebond problem.

PLAQUETTE made READY for testing on 1/30/2007 by Arndt Kirk

P_2x3B_133_Con 1/30/2007 12:23 PM

P_2x3B_133_Con 1/30/2007 12:23 PM

PLAQUETTE TESTED on 2007-01-30 by Gino Bolla

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 46 V
Operational Voltage 86 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC128128140132144138
Vana125115144143139134
Cal_Del878276738587
Vthrs_Comp778283817884
Unbumped010001
Dead100120
Noisy000000
Undecoded000000
Total BAD110121

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

PLAQUETTE READY TO BE POTTED

PLAQUETTE encapsulated on 2/1/2007 by Arndt Kirk

P_2x3B_133_C-1on 2/1/2007 3:11 PM

P_2x3B_133_C-1on 2/1/2007 3:11 PM AFTER POTTING

[IMAGE] of

BAD CHANNELS COMPARISON Before/after ENCAPSULATION

ROCDEADNOISYUNDECODEDTESTDLIGHT
ROC01/10/00/00/10/5
ROC10/00/00/00/01/6
ROC20/00/00/00/00/5
ROC31/10/00/00/00/7
ROC42/20/00/00/00/6
ROC50/00/00/00/01/6

P_2x3B_133_C-2on 2/1/2007 3:19 PM

P_2x3B_133_C-2on 2/1/2007 3:19 PM AFTER POTTING

[IMAGE] of

BAD CHANNELS COMPARISON Before/after ENCAPSULATION

ROCDEADNOISYUNDECODEDTESTDLIGHT
ROC01/10/00/00/10/0
ROC10/00/00/00/01/1
ROC20/00/00/00/00/0
ROC31/10/00/00/00/0
ROC42/20/00/00/00/0
ROC50/00/00/00/01/1

DEVICE READY FOR SHIPPING

Shipped on date 2007-02-05

Plaquette assigned to panel P4L_024