P_1x5L_040_A

Parts committed by Isaac Childres on date 5/10/2007

Part	ID
BBM	BBM_040-1x5
VHDI	1x5L_292

ROC	ROC wafer	Label
ROC0	W33_XC4K5LT	03D
ROC1	W33_XC4K5LT	03C
ROC2	W35_XH4K3HT	55B
ROC3	W35_XH4K3HT	55A
ROC4	W33_XC4K5LT	03B

Inspected by Lockwood Gale on date 6/4/2007

LR_dev	0.059
LL_dev	0.062

PLAQUETTE GLUED with FULL PRESSURE

PLAQUETTE made READY for ENCAPSULATION on 6/4/2007 by Lockwood Gale

PLAQUETTE encapsulated on 6/4/2007 by Kozak Brian

PLAQUETTE made READY for testing on 6/4/2007 by Kozak Brian

P_1x5L_040_Aon 6/5/2007 10:50 AM

P_1x5L_040_A-1on 6/5/2007 11:32 AM

P_1x5L_040_A-2on 6/5/2007 11:39 AM

P_1x5L_040_A-2on 6/5/2007 11:39 AM

PLAQUETTE TESTED on 2007-06-05 by Emily Grace

	IV_XML-File Maximum Voltage 320 V
	LASER_XML-File Depletion Voltage 36 V Operational Voltage 76 V

ASSEMBLY_XML-File	SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
	I_BIAS_DAC_XML-File
	VANA_XML-File
	DEAD_XML-File
	NOISY_XML-File
	UNDECODED_XML-File
	LIGHT_XML-File

EXTRA DACs for NOISE

Noise MAP at VMAX

Efficiency MAP

Noise MAP at -200 V

Efficiency MAP

PLAQUETTE READY TO BE SHIPPED

Inspected by Arndt Kirk on date 6/5/2007

Picture

Comment

ROC2 (on the right in this picture) is shifted down by ~40 microns and to the right by ~20 microns relative to ROC1 (on the left in this picture). The debris on the ROCs was caused by probing after the mis-alignment of ROC2 was noticed. The mis-alignment of ROC2 relative to the sensor and other ROCs was noticed after electrical testing showed almost all ROC2 bump bonds are disconnected from the sensor.

Inspected by Arndt Kirk on date 6/5/2007

Picture	Comment
	ROC2 (on the left in this picture) is shifted down ~40 microns and to the right ~20 microns relative to ROC3 (on the right in this picture). The debris on the ROCs was caused by probing after the mis-alignment of ROC2 was noticed.

Shipped on date 2007-06-11