Parts committed by Bolla Gino on date 2/18/2008
Part | ID |
---|---|
BBM | BBM_007-1x5 |
VHDI | 1x5L_610 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W55_D3LQE4T | 03A |
ROC1 | W55_D3LQE4T | 12B |
ROC2 | W55_D3LQE4T | 12A |
ROC3 | W55_D3LQE4T | 43D |
ROC4 | W55_D3LQE4T | 43C |
Inspected by Lockwood Gale on date 2/22/2008
LR_dev | 0.072 |
LL_dev | 0.031 |
PLAQUETTE GLUED with HALF PRESSURE
FINAL COMMENT by Lockwood Gale | Force used to join BBM to VHDI = 2 kg per ROC. No assembly problems. ROC 0, Ch 1, 2 tries, No Wirebonding problems. |
PLAQUETTE made READY for ENCAPSULATION on 2/22/2008 by Lockwood Gale
PLAQUETTE encapsulated on 2/23/2008 by Ozhan Koybasi
PLAQUETTE made READY for testing on 2/23/2008 by Ozhan Koybasi
P_1x5L_007_Aon 2/26/2008 12:01 AM
P_1x5L_007_A-1on 2/26/2008 10:13 AM
P_1x5L_007_A-1on 2/26/2008 10:13 AM
P_1x5L_007_A-2on 2/26/2008 12:40 PM
P_1x5L_007_A-2on 2/26/2008 12:40 PM
P_1x5L_007_A-3on 2/26/2008 1:45 PM
P_1x5L_007_A-3on 2/26/2008 1:45 PM
P_1x5L_007_A-4on 2/27/2008 8:49 AM
P_1x5L_007_A-4on 2/27/2008 8:49 AM
PLAQUETTE TESTED on 2008-02-27 by Gino Bolla
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | |
Ibias_DAC | 162 | 150 | 148 | 174 | 170 | |
Vana | 142 | 161 | 151 | 157 | 137 | |
Cal_Del | 90 | 87 | 89 | 81 | 86 | |
Vthrs_Comp | 83 | 94 | 91 | 90 | 90 | |
Unbumped | 0 | 31 | 144 | 36 | 40 | |
Dead | 0 | 0 | 0 | 0 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 0 | 31 | 144 | 36 | 40 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 80 | 100 | 100 | 100 | 110 |
Vsf | 140 | 160 | 150 | 150 | 140 |
VoffsetOp | 100 | 95 | 115 | 130 | 115 |
VIbias_PH | 105 | 100 | 95 | 100 | 100 |
Noise MAP at VMAX
Efficiency MAP
Noise MAP at -200 V
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED