P_2x5_171

P_2x5_171_A

Parts committed by Bolla Gino on date 1/31/2007

Part	ID
BBM	BBM_171-2x5
VHDI	2x5_300

ROC ROC wafer Label

ROC0 W30_X74K5RT 22A

ROC1 W30_X74K5RT 21D

ROC2 W30_X74K5RT 21C

ROC3 W30_X74K5RT 21B

ROC4 W30_X74K5RT 21A

ROC5 W30_X74K5RT 17D

ROC6 W30_X74K5RT 18C

ROC7 W30_X74K5RT 18D

ROC8 W30_X74K5RT 03A

ROC9 W30_X74K5RT 03D

ROC	ROC wafer	Label
ROC0	W30_X74K5RT	22A
ROC1	W30_X74K5RT	21D
ROC2	W30_X74K5RT	21C
ROC3	W30_X74K5RT	21B
ROC4	W30_X74K5RT	21A
ROC5	W30_X74K5RT	17D
ROC6	W30_X74K5RT	18C
ROC7	W30_X74K5RT	18D
ROC8	W30_X74K5RT	03A
ROC9	W30_X74K5RT	03D

Inspected by Lockwood Gale on date 2/9/2007

LR_dev 0.065

LL_dev 0.064

FINAL COMMENT by Lockwood Gale No assembly problems No wirebond problem.

PLAQUETTE made READY for testing on 2/9/2007 by Lockwood Gale

P_2x5_171_Aon 2/9/2007 3:50 PM

P_2x5_171_A-1on 2/9/2007 3:51 PM

PLAQUETTE READY TO BE POTTED

PLAQUETTE encapsulated on 2/13/2007 by Ozhan Koybasi

FOB to Plaquette bonds smashed during encapsulation. Back to assembly

FOB to Plaquette bonds Replaced

P_2x5_171_A-2on 2/15/2007 11:15 AM

P_2x5_171_A-3on 2/15/2007 11:23 AM

P_2x5_171_A-4on 2/19/2007 9:18 AM

P_2x5_171_A-5on 2/19/2007 9:30 AM

P_2x5_171_A-6on 2/19/2007 9:38 AM

PLAQUETTE TESTED on 2007-02-19 by Gino Bolla

IV_XML-File

Maximum Voltage 600 V

LASER_XML-File

Depletion Voltage 50 V

Operational Voltage 90 V

ROC	ROC0	ROC1	ROC2	ROC3	ROC4	ROC5	ROC6	ROC7	ROC8	ROC9
Ibias_DAC	144	140	130	136	138	138	140	132	142	132
Vana	134	126	123	129	157	126	139	127	134	129
Cal_Del	72	91	80	98	86	99	67	77	77	91
Vthrs_Comp	76	72	86	69	90	80	87	68	81	65
Unbumped	0	0	0	0	0	0	0	0	0	1
Dead	0	0	0	0	0	0	0	0	0	0
Noisy	0	0	0	0	0	0	0	0	0	0
Undecoded	0	0	0	0	0	0	0	0	0	0
Total BAD	0	0	0	0	0	0	0	0	0	1

ASSEMBLY_XML-File	SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
	I_BIAS_DAC_XML-File
	VANA_XML-File
	DEAD_XML-File
	NOISY_XML-File
	UNDECODED_XML-File
	LIGHT_XML-File