Parts committed by Bolla Gino on date 5/8/2007
Part | ID |
---|---|
BBM | BBM_178-2x4T |
VHDI | 2x4_624 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | KFNG13T | 36B |
ROC1 | KFNG13T | 57B |
ROC2 | KFNG13T | 57A |
ROC3 | KFNG13T | 38B |
ROC4 | KFNG13T | 37A |
ROC5 | KFNG13T | 67D |
ROC6 | KFNG13T | 68A |
ROC7 | KFNG13T | 27C |
Inspected by Arndt Kirk on date 5/10/2007
LR_dev | 0.072 |
LL_dev | 0.071 |
PLAQUETTE GLUED with HALF PRESSURE
FINAL COMMENT by Arndt Kirk | Assembled at HALF-PRESSURE. No assembly problems. ROC3 chn 33,34,35 required two attempts to wirebond to VHDI pads, otherwise no wirebond problems. |
PLAQUETTE made READY for ENCAPSULATION on 5/10/2007 by Arndt Kirk
PLAQUETTE encapsulated on 5/10/2007 by Ortiz Jason
PLAQUETTE made READY for testing on 5/10/2007 by Ortiz Jason
P_2x4T_178_Con 5/15/2007 9:29 AM
P_2x4T_178_Con 5/15/2007 9:29 AM
P_2x4T_178_C-1on 5/15/2007 10:44 AM
P_2x4T_178_C-1on 5/15/2007 10:44 AM
PLAQUETTE TESTED on 2007-05-15 by Emily Grace
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | ROC6 | ROC7 | |
Ibias_DAC | 166 | 162 | 170 | 160 | 148 | 160 | 146 | 150 | |
Vana | 135 | 138 | 137 | 145 | 135 | 132 | 133 | 141 | |
Cal_Del | 62 | 78 | 79 | 74 | 72 | 82 | 68 | 80 | |
Vthrs_Comp | 82 | 75 | 78 | 79 | 82 | 82 | 87 | 86 | |
Unbumped | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Dead | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 120 | 90 | 100 | 90 | 100 | 115 | 105 | 95 |
Vsf | 140 | 145 | 140 | 145 | 140 | 145 | 140 | 140 |
VoffsetOp | 95 | 80 | 95 | 95 | 85 | 90 | 95 | 95 |
VIbias_PH | 100 | 105 | 100 | 95 | 100 | 105 | 100 | 105 |
Noise MAP at VMAX
Efficiency MAP
Noise MAP at -200 V
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED