P_2x4T_175_A

Parts committed by Bolla Gino on date 1/22/2007

PartID
BBMBBM_175-2x4T
VHDI2x4_398

ROCROC waferLabel
ROC0W28_X54K5TT52D
ROC1W28_X54K5TT52B
ROC2W28_X54K5TT52A
ROC3W28_X54K5TT51D
ROC4W28_X54K5TT49D
ROC5W28_X54K5TT30A
ROC6W28_X54K5TT30B
ROC7W28_X54K5TT30C

Inspected by Lockwood Gale on date 1/24/2007
LR_dev0.030
LL_dev0.036
FINAL COMMENT by Lockwood GaleNo assembly problems. No wirebonding problems.

PLAQUETTE made READY for testing on 1/24/2007 by Lockwood Gale

P_2x4T_175_Aon 1/24/2007 11:44 AM

P_2x4T_175_Aon 1/24/2007 11:44 AM

PLAQUETTE TESTED on 2007-01-24 by Isaac Childres

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 48 V
Operational Voltage 88 V

ROCROC0ROC1ROC2ROC3ROC4ROC5ROC6ROC7
Ibias_DAC148140134150146136130144
Vana135134140135138127127135
Cal_Del6877848981928966
Vthrs_Comp7770817372827476
Unbumped00000000
Dead00000000
Noisy00000000
Undecoded00000000
Total BAD00000000

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

PLAQUETTE READY TO BE POTTED

PLAQUETTE encapsulated on 2/1/2007 by Arndt Kirk

P_2x4T_175_A-1on 2/1/2007 3:40 PM

P_2x4T_175_A-1on 2/1/2007 3:40 PM AFTER POTTING

[IMAGE] of

BAD CHANNELS COMPARISON Before/after ENCAPSULATION

ROCDEADNOISYUNDECODEDTESTDLIGHT
ROC00/00/00/00/00/0
ROC10/00/00/00/00/0
ROC20/00/00/00/00/0
ROC30/00/00/00/00/0
ROC40/00/00/00/00/0
ROC50/00/00/00/00/0
ROC60/00/00/00/00/0
ROC70/00/00/00/00/0

DEVICE READY FOR SHIPPING

Shipped on date 2007-02-06

Plaquette assigned to panel P4R_014