P_2x4T_166_C-6

Production testing

Date:8/2/2007

Operator: Petra Merkel

start testing time:12:39 PM

Sensor: S_2x4T_16, Data for leakage current measurement , and plot on overall it is a GOOD sensor
ROCROC waferLabel
ROC0XH4KFBT74B
ROC1XH4KFBT74A
ROC2KMNG2DT44D
ROC3XH4KFBT73A
ROC4XH4KFBT74D
ROC5XH4KFBT74C
ROC6XH4KFBT73D
ROC7XH4KFBT73C

This plaquette was reworked. Old results here

Inspected by Arndt Kirk on date 7/31/2007
LR_dev0.005
LL_dev0.015

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Arndt KirkAssembled at HALF-PRESSURE. no assembly problems. reworked BBM No wirebonding problems (reworked BBM - 2nd bond foot on original ROCs).

PLAQUETTE made READY for ENCAPSULATION on 7/31/2007 by Arndt Kirk

PLAQUETTE encapsulated on 7/31/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 7/31/2007 by Ozhan Koybasi

P_2x4T_166_Con 7/31/2007 1:18 PM

P_2x4T_166_C-1on 7/31/2007 1:25 PM

P_2x4T_166_C-2on 8/1/2007 1:42 PM

P_2x4T_166_C-3on 8/1/2007 1:50 PM

P_2x4T_166_C-4on 8/2/2007 12:24 PM

P_2x4T_166_C-5on 8/2/2007 12:32 PM

P_2x4T_166_C-6on 8/2/2007 12:39 PM

Ibias_DAC, Ibias_DAC Data 158 160 154 146 162 156 158 148
Vana, VanaData 144 124 127 132 130 146 133 125
CalDelData and plots8381756893818182
VthrCompData and plots8382808482767675