P_2x4T_166_C

Production testing

Date:7/31/2007

Operator: Petra Merkel

start testing time:1:18 PM

Sensor: S_2x4T_16, Data for leakage current measurement , and plot on overall it is a GOOD sensor
ROCROC waferLabel
ROC0XH4KFBT74B
ROC1XH4KFBT74A
ROC2KMNG2DT44D
ROC3XH4KFBT73A
ROC4XH4KFBT74D
ROC5XH4KFBT74C
ROC6XH4KFBT73D
ROC7XH4KFBT73C

This plaquette was reworked. Old results here

Inspected by Arndt Kirk on date 7/31/2007
LR_dev0.005
LL_dev0.015

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Arndt KirkAssembled at HALF-PRESSURE. no assembly problems. reworked BBM No wirebonding problems (reworked BBM - 2nd bond foot on original ROCs).

PLAQUETTE made READY for ENCAPSULATION on 7/31/2007 by Arndt Kirk

PLAQUETTE encapsulated on 7/31/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 7/31/2007 by Ozhan Koybasi

P_2x4T_166_Con 7/31/2007 1:18 PM

ADC needs resetting
Ibias_DAC, Ibias_DAC Data 290 290 290 290 290 290 290