P_2x4T_041

P_2x4T_041_C

Parts committed by Arndt Kirk on date 11/28/2006

Part	ID
BBM	BBM_041-2x4T
VHDI	2x4_274

ROC ROC wafer Label

ROC0 XF4K3JT 21A

ROC1 XF4K3JT 30C

ROC2 XF4K3JT 26A

ROC3 XF4K3JT 20A

ROC4 XF4K3JT 23A

ROC5 XF4K3JT 05D

ROC6 XF4K3JT 32D

ROC7 XF4K3JT 20B

ROC	ROC wafer	Label
ROC0	XF4K3JT	21A
ROC1	XF4K3JT	30C
ROC2	XF4K3JT	26A
ROC3	XF4K3JT	20A
ROC4	XF4K3JT	23A
ROC5	XF4K3JT	05D
ROC6	XF4K3JT	32D
ROC7	XF4K3JT	20B

Inspected by Arndt Kirk on date 11/30/2006

LR_dev 0.037

LL_dev 0.055

FINAL COMMENT by Arndt Kirk Zero Pressure Join. No assembly problems. All wirebonds OK. ROCs visibly "bounce" during wirebonding. VHDI flex circuit delaminatied from silicon substrate along edge with pads for HDI wirebonds, did not cause wirebonding problem.

PLAQUETTE made READY for testing on 11/30/2006 by Arndt Kirk

P_2x4T_041_Con 11/30/2006 11:10 AM P_2x4T_041_C-1on 11/30/2006 11:37 AM P_2x4T_041_C-2on 11/30/2006 11:47 AM

PLAQUETTE TESTED on 2006-11-30 by Gino Bolla

IV_XML-File

Maximum Voltage 400 V

LASER_XML-File

Depletion Voltage 46 V

Operational Voltage 86 V

ROC	ROC0	ROC1	ROC2	ROC3	ROC4	ROC5	ROC6	ROC7
Ibias_DAC	129	133	156	131	130	135	135	132
Vana	130	115	128	118	132	133	127	133
Cal_Del	97	74	99	75	103	90	92	90
Vthrs_Comp	76	70	65	71	64	72	74	71
Unbumped	22	534	453	7	1	703	553	3
Dead	0	2	1	0	0	0	0	0
Noisy	0	0	0	0	0	0	0	0
Undecoded	0	0	0	0	0	0	0	0
Total BAD	22	536	454	7	1	703	553	3

ASSEMBLY_XML-File	SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
	I_BIAS_DAC_XML-File
	VANA_XML-File
	DEAD_XML-File
	NOISY_XML-File
	UNDECODED_XML-File
	LIGHT_XML-File

PLAQUETTE READY FOR SHIPPING

PLAQUETTE SHIPPED BACK TO RTI FOR ANALISYS OF BAD BUMPS. WASTED.