P_2x4B_056_C

Parts committed by Bolla Gino on date 5/29/2007

PartID
BBMBBM_056-2x4B
VHDI2x4_712

ROCROC waferLabel
ROC0KMNG2DT32A
ROC1KMNG2DT26B
ROC2KMNG2DT22C
ROC3KMNG2DT05C
ROC4KMNG2DT64A
ROC5KMNG2DT42B
ROC6KMNG2DT74B
ROC7KMNG2DT42D

Inspected by Arndt Kirk on date 6/6/2007
PictureComment
[IMAGE] of [IMAGE] of Crack through silicon substrate of VHDI in corner nearest ROC7 (noticed during visual inspection after BBM joined to VHDI).

Inspected by Lockwood Gale on date 6/7/2007
LR_dev0.022
LL_dev0.021

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Lockwood GaleAssembled at HALF-PRESSURE. No assembly problems. ROC 7, CH 35, ROC 3 Ch 34,17, ROC 1 Ch 34,35 No wirebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 6/7/2007 by Lockwood Gale

PLAQUETTE encapsulated on 6/7/2007 by Kozak Brian

PLAQUETTE made READY for testing on 6/7/2007 by Kozak Brian

P_2x4B_056_Con 6/8/2007 11:09 AM

P_2x4B_056_Con 6/8/2007 11:09 AM

PLAQUETTE TESTED on 2007-06-08 by Emily Grace

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 44 V
Operational Voltage 84 V

ROCROC0ROC1ROC2ROC3ROC4ROC5ROC6ROC7
Ibias_DAC158166154158160160154164
Vana128124144145140143140143
Cal_Del7482807970637580
Vthrs_Comp6476838088888687
Unbumped010001300
Dead00000000
Noisy00000000
Undecoded00000000
Total BAD010001300

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe11511511595851009595
Vsf140140140145140145140145
VoffsetOp809090958511595100
VIbias_PH10010010010510095105100

Noise MAP at VMAX

[IMAGE] of

Efficiency MAP

[IMAGE] of

Noise MAP at -200 V

[IMAGE] of

Efficiency MAP

[IMAGE] of

PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-06-11