P_2x3T_110

P_2x3T_110_C

Parts committed by Bolla Gino on date 4/10/2007

Part	ID
BBM	BBM_110-2x3T
VHDI	2x3_535

ROC ROC wafer Label

ROC0 XH4KFBT 13D

ROC1 XH4KFBT 22D

ROC2 XH4KFBT 12A

ROC3 XH4KFBT 15B

ROC4 XH4KFBT 06C

ROC5 XH4KFBT 15A

ROC	ROC wafer	Label
ROC0	XH4KFBT	13D
ROC1	XH4KFBT	22D
ROC2	XH4KFBT	12A
ROC3	XH4KFBT	15B
ROC4	XH4KFBT	06C
ROC5	XH4KFBT	15A

Inspected by Arndt Kirk on date 4/12/2007

Picture Comment

Wire bond metal off ROC2 bond pad for channel 21 CAP_GND. Looks like a possible short to a sturcture on the ROC connected to channels 31,32 VD+ (4th and 5th wirebond from the left in this picture). All other ROC-to-VHDI wirebonds look good on this plaquette. .

Picture	Comment
	Wire bond metal off ROC2 bond pad for channel 21 CAP_GND. Looks like a possible short to a sturcture on the ROC connected to channels 31,32 VD+ (4th and 5th wirebond from the left in this picture). All other ROC-to-VHDI wirebonds look good on this plaquette. .

Inspected by Arndt Kirk on date 4/12/2007

Picture Comment

Closeup of wire bond metal off the bond pad on ROC2 chn 21 CAP_GND. Three attempts were made to bond a wire to this pad. Broken pieces of clear material can be seen around the bond metal. This clear material could have been a droplet similar to the drop of clear material overlapping the same bond pad on P_2x4T_110_C ROC0 channel 21..

Picture	Comment
	Closeup of wire bond metal off the bond pad on ROC2 chn 21 CAP_GND. Three attempts were made to bond a wire to this pad. Broken pieces of clear material can be seen around the bond metal. This clear material could have been a droplet similar to the drop of clear material overlapping the same bond pad on P_2x4T_110_C ROC0 channel 21..

Inspected by Arndt Kirk on date 4/12/2007

Picture Comment

Picture of the incriminated area after clean-up with a microprobe. The plaquette work fine. Gino.

Picture	Comment
	Picture of the incriminated area after clean-up with a microprobe. The plaquette work fine. Gino.

Inspected by Lockwood Gale on date 4/12/2007

LR_dev 0.099

LL_dev 0.097

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Lockwood Gale

No assembly problems. Assembled at HALF-PRESSURE."ROC2 chn 21 CAP_GND bond metal outside pad, possible short to structure connected to chn 31,32 VD+. All other wirebonds OK."

PLAQUETTE made READY for ENCAPSULATION on 4/12/2007 by Lockwood Gale

PLAQUETTE encapsulated on 4/13/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 4/13/2007 by Ozhan Koybasi

P_2x3T_110_C.html

P_2x3T_110_C-1on 4/17/2007 12:27 PM

PLAQUETTE TESTED on 2007-04-17 by Gino Bolla

IV_XML-File

Maximum Voltage 600 V

LASER_XML-File

Depletion Voltage 46 V

Operational Voltage 86 V

ROC	ROC0	ROC1	ROC2	ROC3	ROC4	ROC5
Ibias_DAC	132	134	142	128	128	128
Vana	141	134	127	124	137	125
Cal_Del	74	80	67	75	80	77
Vthrs_Comp	83	78	89	73	75	85
Unbumped	1	2	0	1	0	6
Dead	0	0	0	0	0	0
Noisy	0	0	0	0	0	0
Undecoded	0	0	0	0	0	0
Total BAD	1	2	0	1	0	6

ASSEMBLY_XML-File	SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
	I_BIAS_DAC_XML-File
	VANA_XML-File
	DEAD_XML-File
	NOISY_XML-File
	UNDECODED_XML-File
	LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe	100	110	135	155	140	140
Vsf	145	140	140	135	140	135
VoffsetOp	70	75	85	65	90	70
VIbias_PH	100	105	95	105	100	95

Noise MAP

Efficiency MAP

PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-04-23

Plaquette assigned to panel P3L_041