Parts committed by Bolla Gino on date 2/5/2007
Part | ID |
---|---|
BBM | BBM_004-2x3T |
VHDI | 2x3_386 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | XE4K3KT | 06A |
ROC1 | XE4K3KT | 11C |
ROC2 | XE4K3KT | 11D |
ROC3 | XE4K3KT | 13D |
ROC4 | XE4K3KT | 13C |
ROC5 | XE4K3KT | 12D |
Inspected by Arndt Kirk on date 2/8/2007
LR_dev | 0.078 |
LL_dev | 0.086 |
FINAL COMMENT by Arndt Kirk | No_assembly_problems All wirebond OK. Accidently landed a bond foot on edge of sensor outside guard ring above ROC5 (cassette moved on workholder during FOM-VHDI wirebonding). |
PLAQUETTE made READY for testing on 2/8/2007 by Arndt Kirk
P_2x3T_004_Con 2/8/2007 4:35 PM
P_2x3T_004_Con 2/8/2007 4:35 PM
PLAQUETTE TESTED on 2007-02-08 by Isaac Childres
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | |
Ibias_DAC | 118 | 126 | 128 | 132 | 140 | 118 | |
Vana | 117 | 127 | 124 | 123 | 133 | 137 | |
Cal_Del | 100 | 76 | 87 | 93 | 70 | 88 | |
Vthrs_Comp | 72 | 70 | 68 | 68 | 88 | 78 | |
Unbumped | 6 | 0 | 0 | 0 | 2 | 1 | |
Dead | 0 | 0 | 0 | 0 | 0 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 6 | 0 | 0 | 0 | 2 | 1 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
Noise MAP
Efficiency MAP
PLAQUETTE READY TO BE POTTED