P_2x3B_115_A

Parts committed by Arndt Kirk on date 3/1/2007

PartID
BBMBBM_115-2x3B
VHDI2x3_613

ROCROC waferLabel
ROC0W34_XA4K3PT57D
ROC1W34_XA4K3PT57C
ROC2W34_XA4K3PT57B
ROC3W34_XA4K3PT30C
ROC4W34_XA4K3PT31B
ROC5W34_XA4K3PT31C

Inspected by Arndt Kirk on date 3/7/2007
LR_dev0.024
LL_dev0.027
FINAL COMMENT by Arndt KirkNo assembly problems. VHDI from "new" batch. Problems bonding channels 1 and 35 pads on VHDI for ROC-VHDI wirebonds. ROC0 chn 1,35; ROC1 chn 35; ROC2 chn 1; ROC4 chn 1,35 required scraping VHDI pads and multiple attempts to bond.

PLAQUETTE made READY for ENCAPSULATION on 3/7/2007 by Arndt Kirk

PLAQUETTE encapsulated on 3/7/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 3/7/2007 by Ozhan Koybasi

P_2x3B_115_Aon 3/8/2007 12:02 PM

P_2x3B_115_Aon 3/8/2007 12:02 PM

PLAQUETTE TESTED on 2007-03-08 by Joseph Clampitt

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IV_XML-File
Maximum Voltage 560 V
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LASER_XML-File
Depletion Voltage 44 V
Operational Voltage 84 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC132140146134146128
Vana128127140115140127
Cal_Del969584808084
Vthrs_Comp667184738380
Unbumped001000
Dead000000
Noisy000000
Undecoded000000
Total BAD001000

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe110120110140115125
Vsf140140140140140130
VoffsetOp80651105510080
VIbias_PH9510010010510095

Noise MAP

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Efficiency MAP

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PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-03-13

Plaquette assigned to panel P4R_063