Parts committed by Arndt Kirk on date 3/1/2007
Part | ID |
---|---|
BBM | BBM_115-2x3B |
VHDI | 2x3_613 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W34_XA4K3PT | 57D |
ROC1 | W34_XA4K3PT | 57C |
ROC2 | W34_XA4K3PT | 57B |
ROC3 | W34_XA4K3PT | 30C |
ROC4 | W34_XA4K3PT | 31B |
ROC5 | W34_XA4K3PT | 31C |
Inspected by Arndt Kirk on date 3/7/2007
LR_dev | 0.024 |
LL_dev | 0.027 |
FINAL COMMENT by Arndt Kirk | No assembly problems. VHDI from "new" batch. Problems bonding channels 1 and 35 pads on VHDI for ROC-VHDI wirebonds. ROC0 chn 1,35; ROC1 chn 35; ROC2 chn 1; ROC4 chn 1,35 required scraping VHDI pads and multiple attempts to bond. |
PLAQUETTE made READY for ENCAPSULATION on 3/7/2007 by Arndt Kirk
PLAQUETTE encapsulated on 3/7/2007 by Ozhan Koybasi
PLAQUETTE made READY for testing on 3/7/2007 by Ozhan Koybasi
P_2x3B_115_Aon 3/8/2007 12:02 PM
P_2x3B_115_Aon 3/8/2007 12:02 PM
PLAQUETTE TESTED on 2007-03-08 by Joseph Clampitt
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | |
Ibias_DAC | 132 | 140 | 146 | 134 | 146 | 128 | |
Vana | 128 | 127 | 140 | 115 | 140 | 127 | |
Cal_Del | 96 | 95 | 84 | 80 | 80 | 84 | |
Vthrs_Comp | 66 | 71 | 84 | 73 | 83 | 80 | |
Unbumped | 0 | 0 | 1 | 0 | 0 | 0 | |
Dead | 0 | 0 | 0 | 0 | 0 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 0 | 0 | 1 | 0 | 0 | 0 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 110 | 120 | 110 | 140 | 115 | 125 |
Vsf | 140 | 140 | 140 | 140 | 140 | 130 |
VoffsetOp | 80 | 65 | 110 | 55 | 100 | 80 |
VIbias_PH | 95 | 100 | 100 | 105 | 100 | 95 |
Noise MAP
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED