Parts committed by Bolla Gino on date 2/18/2008
Part | ID |
---|---|
BBM | BBM_003-2x3B |
VHDI | 2x3_221 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W53_DXLQY9T | 27C |
ROC1 | W53_DXLQY9T | 27B |
ROC2 | W53_DXLQY9T | 26D |
ROC3 | W53_DXLQY9T | 12B |
ROC4 | W53_DXLQY9T | 13A |
ROC5 | W53_DXLQY9T | 13D |
Inspected by Lockwood Gale on date 2/22/2008
LR_dev | 0.060 |
LL_dev | 0.061 |
PLAQUETTE GLUED with HALF PRESSURE
FINAL COMMENT by Lockwood Gale | Force used to join BBM to VHDI = 2.5 kg per ROC. No assembly problems. No wirebonding problems. |
PLAQUETTE made READY for ENCAPSULATION on 2/22/2008 by Lockwood Gale
PLAQUETTE encapsulated on 2/23/2008 by Ozhan Koybasi
PLAQUETTE made READY for testing on 2/23/2008 by Ozhan Koybasi
P_2x3B_003_Aon 2/23/2008 6:23 PM
P_2x3B_003_A-1on 2/23/2008 6:36 PM
P_2x3B_003_A-2on 2/23/2008 6:51 PM
P_2x3B_003_A-3on 2/25/2008 10:09 AM
P_2x3B_003_A-4on 2/25/2008 10:20 AM
P_2x3B_003_A-5on 2/25/2008 10:34 AM
P_2x3B_003_A-6on 2/25/2008 10:37 AM
P_2x3B_003_A-7on 2/25/2008 10:38 AM
P_2x3B_003_A-7on 2/25/2008 10:38 AM
PLAQUETTE TESTED on 2008-02-25 by Gino Bolla
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | |
Ibias_DAC | 174 | 164 | 158 | 146 | 166 | 160 | |
Vana | 153 | 144 | 144 | 141 | 144 | 133 | |
Cal_Del | 84 | 88 | 87 | 98 | 60 | 97 | |
Vthrs_Comp | 91 | 85 | 89 | 77 | 87 | 78 | |
Unbumped | 0 | 0 | 0 | 0 | 0 | 0 | |
Dead | 0 | 0 | 0 | 2 | 0 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 0 | 0 | 0 | 2 | 0 | 0 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 105 | 85 | 95 | 95 | 105 | 125 |
Vsf | 150 | 150 | 145 | 140 | 145 | 140 |
VoffsetOp | 145 | 110 | 115 | 85 | 135 | 95 |
VIbias_PH | 100 | 100 | 100 | 95 | 95 | 105 |
Noise MAP at VMAX
Efficiency MAP
Noise MAP at -200 V
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED