P_1x2L_133_C

Parts committed by Bolla Gino on date 1/25/2007

PartID
BBMBBM_133-1x2T
VHDI1x2L_228

ROCROC waferLabel
ROC0XE4KFET28A
ROC1XE4KFET39D

Inspected by Arndt Kirk on date 1/29/2007
LR_dev0.046
LL_dev0.068
FINAL COMMENT by Arndt KirkNo assembly problem. No wirebond problem.

PLAQUETTE made READY for testing on 1/29/2007 by Arndt Kirk

P_1x2L_133_Con 1/31/2007 1:12 PM

P_1x2L_133_C-1on 1/31/2007 1:30 PM

P_1x2L_133_C-2on 1/31/2007 1:48 PM

P_1x2L_133_C-2on 1/31/2007 1:48 PM

PLAQUETTE TESTED on 2007-01-31 by Gino Bolla

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 50 V
Operational Voltage 90 V

ROCROC0ROC1
Ibias_DAC128134
Vana125122
Cal_Del8884
Vthrs_Comp7173
Unbumped00
Dead00
Noisy00
Undecoded00
Total BAD00

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

PLAQUETTE READY TO BE POTTED

PLAQUETTE encapsulated on 2/2/2007 by Arndt Kirk

P_1x2L_133_C-3on 2/2/2007 3:24 PM

P_1x2L_133_C-3on 2/2/2007 3:24 PM AFTER POTTING

[IMAGE] of

BAD CHANNELS COMPARISON Before/after ENCAPSULATION

ROCDEADNOISYUNDECODEDTESTDLIGHT
ROC00/00/00/02/50/0
ROC10/00/00/00/00/0

DEVICE READY FOR SHIPPING

Shipped on date 2007-02-06

Plaquette assigned to panel P4L_019