P_1x2L_102_A

Parts committed by Bolla Gino on date 2/13/2007

PartID
BBMBBM_102-1x2T
VHDI1x2L_246

ROCROC waferLabel
ROC0W29_X64K5ST47C
ROC1W29_X64K5ST47B

Inspected by Arndt Kirk on date 2/27/2007
LR_dev0.038
LL_dev0.060
FINAL COMMENT by Arndt KirkNo assembly problems. No wirebond problem.

PLAQUETTE made READY for ENCAPSULATION on 2/27/2007 by Arndt Kirk

Inspected by Arndt Kirk on date 2/27/2007
PictureComment
[IMAGE] of Small bubbles in encapsulant near VHDI pads for wirebonds to ROC0 channels 1-7.

PLAQUETTE encapsulated on 2/27/2007 by Arndt Kirk

PLAQUETTE made READY for testing on 2/27/2007 by Arndt Kirk

P_1x2L_102_Aon 2/28/2007 11:59 AM

P_1x2L_102_Aon 2/28/2007 11:59 AM

PLAQUETTE TESTED on 2007-02-28 by Isaac Childres

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 46 V
Operational Voltage 86 V

ROCROC0ROC1
Ibias_DAC138140
Vana121137
Cal_Del9080
Vthrs_Comp7768
Unbumped00
Dead00
Noisy00
Undecoded00
Total BAD00

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe180100
Vsf135140
VoffsetOp8070
VIbias_PH95105

Noise MAP

[IMAGE] of

Efficiency MAP

[IMAGE] of

PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-03-01

Plaquette assigned to panel P4L_038