P_2x5_148_A

Parts committed by Bolla Gino on date 2/15/2007

PartID
BBMBBM_148-2x5
VHDI2x5_394

ROCROC waferLabel
ROC0W29_X64K5ST26D
ROC1W29_X64K5ST26C
ROC2W29_X64K5ST26B
ROC3W29_X64K5ST25D
ROC4W29_X64K5ST25A
ROC5W33_XC4K5LT73B
ROC6W33_XC4K5LT73C
ROC7W33_XC4K5LT73D
ROC8W33_XC4K5LT74A
ROC9W33_XC4K5LT74B

Inspected by Arndt Kirk on date 2/20/2007
LR_dev0.078
LL_dev0.071
FINAL COMMENT by Arndt KirkBBM joined to VHDI initially in air. Nominal joining force applied in vacuum. All bonds OK - ROC0 and 1 chn 35, and ROC2 chn 23 required multiple attempts to bond VHDI pads.

PLAQUETTE made READY for testing on 2/20/2007 by Arndt Kirk

PLAQUETTE encapsulated on 2/21/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 2/21/2007 by Ozhan Koybasi

P_2x5_148_Aon 2/21/2007 12:19 PM

P_2x5_148_Aon 2/21/2007 12:19 PM

PLAQUETTE TESTED on 2007-02-21 by Cameron McKinney

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 48 V
Operational Voltage 88 V

ROCROC0ROC1ROC2ROC3ROC4ROC5ROC6ROC7ROC8ROC9
Ibias_DAC134130132154132142148134148138
Vana140132139144124151144138133135
Cal_Del67757164877667746572
Vthrs_Comp73838284748886878786
Unbumped0000000003
Dead9100000000
Noisy0000000004
Undecoded0000000000
Total BAD9100000007

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe95125100951309595100120125
Vsf140135140145135145145140140140
VoffsetOp85759080859085658580
VIbias_PH9511010510510010510010595100

Noise MAP

[IMAGE] of

Efficiency MAP

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PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-02-26

Plaquette assigned to panel P3R_025