Sensor: S_2x5_069, Data for leakage current measurement , and plot on overall it is a GOOD sensor
| ROC | ROC wafer | Label |
|---|---|---|
| ROC0 | W55_D3LQE4T | 04D |
| ROC1 | W55_D3LQE4T | 04C |
| ROC2 | W55_D3LQE4T | 04B |
| ROC3 | W55_D3LQE4T | 04A |
| ROC4 | W55_D3LQE4T | 03B |
| ROC5 | W52_D0LQC8T | 28B |
| ROC6 | W52_D0LQC8T | 28C |
| ROC7 | W52_D0LQC8T | 28D |
| ROC8 | W52_D0LQC8T | 29A |
| ROC9 | W52_D0LQC8T | 11B |
Inspected by Lockwood Gale on date 12/5/2007
| LR_dev | 0.043 |
| LL_dev | 0.023 |
PLAQUETTE GLUED with HALF PRESSURE
| FINAL COMMENT by Lockwood Gale | Force used to join BBM to VHDI = 2.5 kg per ROC. No assembly problems. ROC 4,Ch 35, 2FL, 5 tries, ROC 7, CH 1, 2FL 4 tries, ROC 0 Ch 35, 2FL, 2 Tries, No other wirebonding problems. |
PLAQUETTE made READY for ENCAPSULATION on 12/5/2007 by Lockwood Gale
PLAQUETTE encapsulated on 12/7/2007 by Ozhan Koybasi
PLAQUETTE made READY for testing on 12/7/2007 by Ozhan Koybasi
P_2x5_069_Aon 12/11/2007 11:27 AM
| Ibias_DAC, Ibias_DAC Data | 144 | 150 | 144 | 150 | 154 | 146 | 150 | 156 | 148 | 148 |
| Vana, VanaData | 151 | 145 | 142 | 159 | 138 | 135 | 142 | 145 | 149 | 139 |
| CalDelData and plots | 91 | 86 | 100 | 82 | 79 | 90 | 89 | 78 | 74 | 83 |
| VthrCompData and plots | 84 | 92 | 72 | 93 | 89 | 79 | 77 | 90 | 87 | 87 |
