P_2x4B_157_A

Parts committed by Bolla Gino on date 12/15/2006

PartID
BBMBBM_157-2x4B
VHDI2x4_320

ROCROC waferLabel
ROC0W21_XA4KFIT37B
ROC1W21_XA4KFIT36D
ROC2W21_XA4KFIT36C
ROC3W21_XA4KFIT36B
ROC4W21_XA4KFIT12A
ROC5W21_XA4KFIT12B
ROC6W21_XA4KFIT12C
ROC7W21_XA4KFIT13A

Inspected by Arndt Kirk on date 12/18/2006
LR_dev0.025
LL_dev0.060
FINAL COMMENT by Arndt KirkNo assembly problem. No wirebond problem. BBM motion ("bounce") during wirebonding of ROC0.

PLAQUETTE made READY for testing on 12/18/2006 by Arndt Kirk

P_2x4B_157_Aon 12/18/2006 1:48 PM

PLAQUETTE TESTED on 2006-12-18 by Petra Merkel

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 52 V
Operational Voltage 92 V

ROCROC0ROC1ROC2ROC3ROC4ROC5ROC6ROC7
Ibias_DAC143130137139137136128131
Vana135143133109123126138135
Cal_Del76829510189798771
Vthrs_Comp6780646574817176
Unbumped00000001
Dead10000000
Noisy00000000
Undecoded00000000
Total BAD10000001

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

PLAQUETTE READY FOR SHIPPING

Shipped on date 2007-01-05

Plaquette assigned to panel P4L_023