P_2x4B_156_A

Parts committed by Bolla Gino on date 1/22/2007

PartID
BBMBBM_156-2x4B
VHDI2x4_399

ROCROC waferLabel
ROC0W28_X54K5TT66B
ROC1W28_X54K5TT66A
ROC2W28_X54K5TT65D
ROC3W28_X54K5TT64D
ROC4W28_X54K5TT43D
ROC5W28_X54K5TT44B
ROC6W28_X54K5TT45A
ROC7W28_X54K5TT45B

Inspected by Lockwood Gale on date 1/25/2007
LR_dev0.053
LL_dev0.063
FINAL COMMENT by Lockwood GaleNo assembly problems. No wirebonding problems.

PLAQUETTE made READY for testing on 1/25/2007 by Lockwood Gale

P_2x4B_156_Aon 1/26/2007 12:41 PM

P_2x4B_156_Aon 1/26/2007 12:41 PM

PLAQUETTE TESTED on 2007-01-26 by Isaac Childres

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 48 V
Operational Voltage 88 V

ROCROC0ROC1ROC2ROC3ROC4ROC5ROC6ROC7
Ibias_DAC142128146146146144146132
Vana123122124144140128140140
Cal_Del9386758696808481
Vthrs_Comp7072738482758183
Unbumped10000000
Dead00000000
Noisy00002000
Undecoded00000000
Total BAD10002000

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

PLAQUETTE READY TO BE POTTED

PLAQUETTE encapsulated on 2/1/2007 by Arndt Kirk

P_2x4B_156_A-1on 2/1/2007 3:03 PM

P_2x4B_156_A-1on 2/1/2007 3:03 PM AFTER POTTING

[IMAGE] of

BAD CHANNELS COMPARISON Before/after ENCAPSULATION

ROCDEADNOISYUNDECODEDTESTDLIGHT
ROC00/00/00/01/11/1
ROC10/00/00/00/00/0
ROC20/00/00/00/00/0
ROC30/00/00/00/00/0
ROC40/02/00/00/00/0
ROC50/00/00/00/00/0
ROC60/00/00/00/00/0
ROC70/00/00/00/00/0

DEVICE READY FOR SHIPPING

Shipped on date 2007-02-02

Plaquette assigned to panel P3L_016