Parts committed by Arndt Kirk on date 2/27/2007
Part | ID |
---|---|
BBM | BBM_124-2x4B |
VHDI | 2x4_295 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W35_XH4K3HT | 65D |
ROC1 | W35_XH4K3HT | 64D |
ROC2 | W35_XH4K3HT | 64C |
ROC3 | W35_XH4K3HT | 64B |
ROC4 | W36_XD4K3LT | 25B |
ROC5 | W36_XD4K3LT | 25C |
ROC6 | W36_XD4K3LT | 25D |
ROC7 | W36_XD4K3LT | 26A |
Inspected by Arndt Kirk on date 3/1/2007
LR_dev | 0.061 |
LL_dev | 0.054 |
FINAL COMMENT by Arndt Kirk | No assembly problems. All wirebonds OK. ROC3 chn 22,23 and ROC5 chn 33,34 required multiple attempts to bond. |
PLAQUETTE made READY for ENCAPSULATION on 3/1/2007 by Arndt Kirk
PLAQUETTE encapsulated on 3/2/2007 by Arndt Kirk
PLAQUETTE made READY for testing on 3/2/2007 by Arndt Kirk
P_2x4B_124_Aon 3/5/2007 12:49 PM
P_2x4B_124_Aon 3/5/2007 12:49 PM
PLAQUETTE TESTED on 2007-03-05 by Joseph Clampitt
|
||||
|
ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | ROC6 | ROC7 | |
Ibias_DAC | 124 | 140 | 144 | 130 | 146 | 144 | 126 | 140 | |
Vana | 124 | 127 | 128 | 126 | 145 | 130 | 127 | 131 | |
Cal_Del | 77 | 90 | 85 | 97 | 81 | 100 | 84 | 87 | |
Vthrs_Comp | 73 | 71 | 76 | 71 | 85 | 72 | 71 | 82 | |
Unbumped | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Dead | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 125 | 120 | 110 | 125 | 105 | 125 | 135 | 115 |
Vsf | 135 | 130 | 140 | 140 | 145 | 145 | 140 | 140 |
VoffsetOp | 60 | 80 | 75 | 70 | 95 | 85 | 70 | 110 |
VIbias_PH | 105 | 105 | 100 | 105 | 100 | 100 | 100 | 105 |
Noise MAP
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED