P_2x4B_118_A

Parts committed by Bolla Gino on date 11/20/2006

PartID
BBMBBM_118-2x4B
VHDI2x4_313

ROCROC waferLabel
ROC0W21_XA4KFIT57B
ROC1W21_XA4KFIT57A
ROC2W21_XA4KFIT56D
ROC3W21_XA4KFIT56C
ROC4W21_XA4KFIT49B
ROC5W21_XA4KFIT49C
ROC6W21_XA4KFIT30A
ROC7W21_XA4KFIT30B

Inspected by Graves Durand on date 11/22/2006
LR_dev0.026
LL_dev0.042
FINAL COMMENT by Graves DurandNo assembly problems. ROC2, Ch23, wirebonder hit silicon debris on VHDI Pad. Bonds are deformed, but deemed ok.

PLAQUETTE made READY for testing on 11/22/2006 by Graves Durand

P_2x4B_118_Aon 11/27/2006 4:12 PM

PLAQUETTE TESTED on 2006-11-27 by Isaac Childres

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 46 V
Operational Voltage 86 V

ROCROC0ROC1ROC2ROC3ROC4ROC5ROC6ROC7
Ibias_DAC142137148147155145136124
Vana116127132126127135125101
Cal_Del9670777780828895
Vthrs_Comp6884707877767058
Unbumped00000001
Dead10000050
Noisy00000000
Undecoded00000000
Total BAD10000051

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

PLAQUETTE READY FOR SHIPPING

Shipped on date 2006-11-29

Plaquette assigned to panel P3R_014