P_2x4B_115_A

Parts committed by Arndt Kirk on date 2/27/2007

PartID
BBMBBM_115-2x4B
VHDI2x4_292

ROCROC waferLabel
ROC0W34_XA4K3PT40B
ROC1W34_XA4K3PT40A
ROC2W34_XA4K3PT58D
ROC3W34_XA4K3PT58A
ROC4W34_XA4K3PT31D
ROC5W34_XA4K3PT32A
ROC6W34_XA4K3PT32C
ROC7W34_XA4K3PT32D

Inspected by Arndt Kirk on date 3/9/2007
LR_dev0.045
LL_dev0.029
FINAL COMMENT by Arndt Kirkno assembly problems ROC0 chn 1; ROC1 chn 3; ROC2 chn 21,22,23,24; ROC3 chn 23 required multiple bond attempts to bond to VHDI pads. All wirebonds OK.

PLAQUETTE made READY for ENCAPSULATION on 3/9/2007 by Arndt Kirk

PLAQUETTE encapsulated on 3/9/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 3/9/2007 by Ozhan Koybasi

P_2x4B_115_Aon 3/12/2007 1:38 PM

P_2x4B_115_Aon 3/12/2007 1:38 PM

PLAQUETTE TESTED on 2007-03-12 by Gino Bolla

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 48 V
Operational Voltage 88 V

ROCROC0ROC1ROC2ROC3ROC4ROC5ROC6ROC7
Ibias_DAC134132148144136150138144
Vana117124144131143153123143
Cal_Del8575958499738759
Vthrs_Comp7474808474928588
Unbumped00000000
Dead00000110
Noisy000000510
Undecoded00000300
Total BAD000004520

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe1251359510511595095
Vsf1351351401401401500140
VoffsetOp65501108590230085
VIbias_PH100100100100105100095

Noise MAP

[IMAGE] of

Efficiency MAP

[IMAGE] of

The noise analysis code does NOT deal well with the channels on the last row of ROC6 that cannot be killed. As a consequence the maps look empty in that ROC. I am curious to see what FNAL come up with for this ROC.

PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-03-23