Parts committed by Arndt Kirk on date 2/27/2007
Part | ID |
---|---|
BBM | BBM_101-2x4B |
VHDI | 2x4_291 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W33_XC4K5LT | 30B |
ROC1 | W33_XC4K5LT | 30A |
ROC2 | W33_XC4K5LT | 49D |
ROC3 | W33_XC4K5LT | 49C |
ROC4 | W33_XC4K5LT | 22D |
ROC5 | W33_XC4K5LT | 23A |
ROC6 | W33_XC4K5LT | 23B |
ROC7 | W33_XC4K5LT | 23C |
Inspected by Arndt Kirk on date 3/7/2007
LR_dev | 0.051 |
LL_dev | 0.042 |
FINAL COMMENT by Arndt Kirk | No assembly problems. All wirebonds OK. ROC4 chn 25 required multiple attempts to bond. |
PLAQUETTE made READY for ENCAPSULATION on 3/7/2007 by Arndt Kirk
PLAQUETTE encapsulated on 3/7/2007 by Ozhan Koybasi
PLAQUETTE made READY for testing on 3/7/2007 by Ozhan Koybasi
P_2x4B_101_Aon 3/8/2007 12:25 PM
P_2x4B_101_Aon 3/8/2007 12:25 PM
PLAQUETTE TESTED on 2007-03-08 by Joseph Clampitt
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | ROC6 | ROC7 | |
Ibias_DAC | 126 | 126 | 142 | 146 | 144 | 142 | 134 | 134 | |
Vana | 109 | 133 | 123 | 139 | 144 | 143 | 129 | 130 | |
Cal_Del | 98 | 74 | 70 | 81 | 64 | 73 | 85 | 82 | |
Vthrs_Comp | 59 | 68 | 85 | 86 | 89 | 79 | 74 | 82 | |
Unbumped | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Dead | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 0 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 185 | 95 | 115 | 120 | 120 | 85 | 130 | 130 |
Vsf | 140 | 140 | 140 | 140 | 140 | 140 | 140 | 140 |
VoffsetOp | 55 | 75 | 90 | 105 | 90 | 95 | 75 | 75 |
VIbias_PH | 100 | 100 | 100 | 100 | 105 | 100 | 105 | 105 |
Noise MAP
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED