P_2x4B_030_A

Parts committed by Bolla Gino on date 4/23/2007

PartID
BBMBBM_030-2x4B
VHDI2x4_569

ROCROC waferLabel
ROC0W35_XH4K3HT15B
ROC1W35_XH4K3HT15A
ROC2W35_XH4K3HT14D
ROC3W35_XH4K3HT14C
ROC4W35_XH4K3HT33D
ROC5W35_XH4K3HT34B
ROC6W35_XH4K3HT34C
ROC7W35_XH4K3HT34D

Inspected by Lockwood Gale on date 4/24/2007
LR_dev0.063
LL_dev0.061

PLAQUETTE GLUED with FULL PRESSURE

FINAL COMMENT by Lockwood GaleNo assembly problems. ROC 6, ch 24, ROC 1, Ch 20,24,25,34, ROC 3 Ch 35 2 attempts, not wiorebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 4/24/2007 by Lockwood Gale

PLAQUETTE encapsulated on 4/24/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 4/24/2007 by Ozhan Koybasi

Inspected by Arndt Kirk on date 4/24/2007
PictureComment
[IMAGE] of Chips in edges of the sensor (noted during encapsulation of plaquette wirebonds).

P_2x4B_030_Aon 4/25/2007 9:49 AM

P_2x4B_030_Aon 4/25/2007 9:49 AM

PLAQUETTE TESTED on 2007-04-25 by Gino Bolla

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 50 V
Operational Voltage 90 V

ROCROC0ROC1ROC2ROC3ROC4ROC5ROC6ROC7
Ibias_DAC136148136132140122138120
Vana115127116146147124126122
Cal_Del7683827090947088
Vthrs_Comp7778708582698768
Unbumped00000000
Dead00000000
Noisy00000000
Undecoded00000000
Total BAD00000000

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe16013014010095130125145
Vsf135140135145145135135140
VoffsetOp75856580100608550
VIbias_PH10010010510010010095100

Noise MAP

[IMAGE] of

Efficiency MAP

[IMAGE] of

PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-04-27

Plaquette assigned to panel P3L_011