P_2x4B_019_A

Parts committed by Bolla Gino on date 11/19/2007

PartID
BBMBBM_019-2x4B
VHDI2x4_727

ROCROC waferLabel
ROC0W53_DXLQG9T67B
ROC1W53_DXLQG9T67A
ROC2W53_DXLQG9T66C
ROC3W53_DXLQG9T66B
ROC4W53_DXLQG9T48B
ROC5W53_DXLQG9T48C
ROC6W53_DXLQG9T48D
ROC7W53_DXLQG9T49A

Inspected by Lockwood Gale on date 12/4/2007
LR_dev0.046
LL_dev0.035

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Lockwood GaleForce used to join BBM to VHDI = 2.5 kg per ROC. No assembly problems. ROC 3, Ch 23,2FL,2 tries, ROC 7, CH 1,2,3,4 2-4 tries, ROC 3, Ch 23,2FL, 2 tries, no other wirebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 12/4/2007 by Lockwood Gale

PLAQUETTE encapsulated on 12/4/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 12/4/2007 by Ozhan Koybasi

P_2x4B_019_Aon 12/7/2007 11:10 AM

P_2x4B_019_Aon 12/7/2007 11:10 AM

PLAQUETTE TESTED on 2007-12-07 by Ozhan Koybasi

[IMAGE] of
IV_XML-File
Maximum Voltage 570 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 50 V
Operational Voltage 90 V

ROCROC0ROC1ROC2ROC3ROC4ROC5ROC6ROC7
Ibias_DAC164158144156154160160160
Vana149158141142154144150145
Cal_Del7690866882719380
Vthrs_Comp8787759384908385
Unbumped00000000
Dead12002000
Noisy00000000
Undecoded00000000
Total BAD12002000

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe95909595901009590
Vsf155155140140150145150145
VoffsetOp120125951101151159595
VIbias_PH100105951001051009595

Noise MAP at VMAX

[IMAGE] of

Efficiency MAP

[IMAGE] of

Noise MAP at -200 V

[IMAGE] of

Efficiency MAP

[IMAGE] of

PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-12-13