P_2x3T_148

P_2x3T_148_A

Parts committed by Bolla Gino on date 2/15/2007

Part	ID
BBM	BBM_148-2x3T
VHDI	2x3_468

ROC ROC wafer Label

ROC0 W29_X64K5ST 27D

ROC1 W29_X64K5ST 27C

ROC2 W29_X64K5ST 27B

ROC3 W33_XC4K5LT 74C

ROC4 W33_XC4K5LT 74D

ROC5 W33_XC4K5LT 75A

ROC	ROC wafer	Label
ROC0	W29_X64K5ST	27D
ROC1	W29_X64K5ST	27C
ROC2	W29_X64K5ST	27B
ROC3	W33_XC4K5LT	74C
ROC4	W33_XC4K5LT	74D
ROC5	W33_XC4K5LT	75A

Inspected by Arndt Kirk on date 2/21/2007

Picture Comment

Could not stick wirebond to VHDI pad for ROC0 chn 35 GND_CAP after multiple attempts. Repair wirebond is connected between ROC0 chn 35 pad and scraped trace near VHDI pad (shown here). The height of this repair wire is taller than the normal ROC-to-VHDI wire loop height.

Picture	Comment
	Could not stick wirebond to VHDI pad for ROC0 chn 35 GND_CAP after multiple attempts. Repair wirebond is connected between ROC0 chn 35 pad and scraped trace near VHDI pad (shown here). The height of this repair wire is taller than the normal ROC-to-VHDI wire loop height.

Inspected by Arndt Kirk on date 2/21/2007

Picture Comment

Closeup of repair wirebond to scraped trace on VHDI for ROC0 chn 35-to-VHDI connection.

Picture	Comment
	Closeup of repair wirebond to scraped trace on VHDI for ROC0 chn 35-to-VHDI connection.

Inspected by Arndt Kirk on date 2/21/2007

Picture Comment

Closeup of repair wirebond on ROC0 chn 35 pad.

Picture	Comment
	Closeup of repair wirebond on ROC0 chn 35 pad.

Inspected by Arndt Kirk on date 2/21/2007

LR_dev 0.098

LL_dev 0.104

FINAL COMMENT by Arndt Kirk No assembly problems. Channel 35 GND_CAP VHDI pad required multiple attempts to wirebond to ROC1 and ROC5. Unable to bond to VHDI pad for ROC0 chn 35 wirebond. Repair wire was bonded from ROC to scraped trace near VHDI pad, result is taller than normal loop height All wirebond connections appear OK.

PLAQUETTE made READY for ENCAPSULATION on 2/21/2007 by Arndt Kirk

PLAQUETTE encapsulated on 2/22/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 2/22/2007 by Ozhan Koybasi

P_2x3T_148_Aon 2/23/2007 1:41 PM

PLAQUETTE TESTED on 2007-02-23 by Isaac Childres

IV_XML-File

Maximum Voltage 600 V

LASER_XML-File

Depletion Voltage 46 V

Operational Voltage 86 V

ROC	ROC0	ROC1	ROC2	ROC3	ROC4	ROC5
Ibias_DAC	132	130	126	144	144	138
Vana	117	116	116	138	151	134
Cal_Del	89	73	98	69	67	76
Vthrs_Comp	71	71	61	87	92	71
Unbumped	0	0	0	0	0	0
Dead	0	0	0	0	0	0
Noisy	0	0	0	0	0	0
Undecoded	0	0	0	0	0	0
Total BAD	0	0	0	0	0	0

ASSEMBLY_XML-File	SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
	I_BIAS_DAC_XML-File
	VANA_XML-File
	DEAD_XML-File
	NOISY_XML-File
	UNDECODED_XML-File
	LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe	145	145	170	120	100	100
Vsf	145	130	135	140	150	140
VoffsetOp	70	80	55	95	115	65
VIbias_PH	100	95	95	100	100	105

Noise MAP

Efficiency MAP

PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-02-26

Plaquette assigned to panel P4R_076