Parts committed by Bolla Gino on date 11/8/2007
Part | ID |
---|---|
BBM | BBM_136-2x3T |
VHDI | 2x3_749 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W52_DOLQC8T | 76D |
ROC1 | W52_DOLQC8T | 75C |
ROC2 | W52_DOLQC8T | 75A |
ROC3 | W52_DOLQC8T | 44B |
ROC4 | W52_DOLQC8T | 44C |
ROC5 | W52_DOLQC8T | 44D |
Inspected by Arndt Kirk on date 12/6/2007
LR_dev | 0.058 |
LL_dev | 0.056 |
PLAQUETTE GLUED with HALF PRESSURE
FINAL COMMENT by Arndt Kirk | Force used to join BBM to VHDI = 2.5 kg per ROC. No assembly problems. Bond pads on VHDI for ROC2 bonds are narrow. ROC2 ch 18 2FL 2 tries, ROC4 ch 28 WO 2 tries. No other wirebond problems. |
PLAQUETTE made READY for ENCAPSULATION on 12/6/2007 by Arndt Kirk
PLAQUETTE encapsulated on 12/7/2007 by Ozhan Koybasi
PLAQUETTE made READY for testing on 12/7/2007 by Ozhan Koybasi
P_2x3T_136_Aon 12/7/2007 4:25 PM
P_2x3T_136_Aon 12/7/2007 4:25 PM
PLAQUETTE TESTED on 2007-12-07 by Ozhan Koybasi
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | |
Ibias_DAC | 166 | 176 | 176 | 160 | 162 | 158 | |
Vana | 149 | 149 | 166 | 154 | 144 | 158 | |
Cal_Del | 66 | 80 | 51 | 62 | 64 | 83 | |
Vthrs_Comp | 88 | 88 | 87 | 86 | 92 | 88 | |
Unbumped | 0 | 0 | 0 | 0 | 0 | 0 | |
Dead | 0 | 0 | 0 | 0 | 0 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 0 | 0 | 0 | 0 | 0 | 0 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 90 | 100 | 105 | 110 | 95 | 105 |
Vsf | 150 | 150 | 165 | 150 | 150 | 150 |
VoffsetOp | 100 | 135 | 145 | 125 | 125 | 135 |
VIbias_PH | 100 | 100 | 100 | 95 | 100 | 100 |
Noise MAP at VMAX
Efficiency MAP
Noise MAP at -200 V
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED