P_2x3T_136_A

Parts committed by Bolla Gino on date 11/8/2007

PartID
BBMBBM_136-2x3T
VHDI2x3_749

ROCROC waferLabel
ROC0W52_DOLQC8T76D
ROC1W52_DOLQC8T75C
ROC2W52_DOLQC8T75A
ROC3W52_DOLQC8T44B
ROC4W52_DOLQC8T44C
ROC5W52_DOLQC8T44D

Inspected by Arndt Kirk on date 12/6/2007
LR_dev0.058
LL_dev0.056

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Arndt KirkForce used to join BBM to VHDI = 2.5 kg per ROC. No assembly problems. Bond pads on VHDI for ROC2 bonds are narrow. ROC2 ch 18 2FL 2 tries, ROC4 ch 28 WO 2 tries. No other wirebond problems.

PLAQUETTE made READY for ENCAPSULATION on 12/6/2007 by Arndt Kirk

PLAQUETTE encapsulated on 12/7/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 12/7/2007 by Ozhan Koybasi

P_2x3T_136_Aon 12/7/2007 4:25 PM

P_2x3T_136_Aon 12/7/2007 4:25 PM

PLAQUETTE TESTED on 2007-12-07 by Ozhan Koybasi

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IV_XML-File
Maximum Voltage 600 V
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LASER_XML-File
Depletion Voltage 44 V
Operational Voltage 84 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC166176176160162158
Vana149149166154144158
Cal_Del668051626483
Vthrs_Comp888887869288
Unbumped000000
Dead000000
Noisy000000
Undecoded000000
Total BAD000000

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe9010010511095105
Vsf150150165150150150
VoffsetOp100135145125125135
VIbias_PH10010010095100100

Noise MAP at VMAX

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Efficiency MAP

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Noise MAP at -200 V

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Efficiency MAP

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PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-12-13