P_2x3T_128_A

Parts committed by Bolla Gino on date 11/20/2006

PartID
BBMBBM_128-2x3T
VHDI2x3_209

ROCROC waferLabel
ROC0W19_XN4K38T61C
ROC1W19_XN4K38T61A
ROC2W19_XN4K38T76D
ROC3W19_XN4K38T16B
ROC4W19_XN4K38T21B
ROC5W19_XN4K38T21D

Inspected by Graves Durand on date 11/22/2006
LR_dev0.049
LL_dev0.048
FINAL COMMENT by Graves DurandNo assembly problems No wirebonding problems.

PLAQUETTE made READY for testing on 11/22/2006 by Graves Durand

P_2x3T_128_Aon 11/27/2006 12:44 PM P_2x3T_128_A-1on 11/27/2006 1:24 PM

P_2x3T_128_A-2on 1/16/2007 4:02 PM

PLAQUETTE TESTED on 2007-01-16 by Petra Merkel

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 44 V
Operational Voltage 84 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC138142140144132140
Vana140132129127138114
Cal_Del797775738998
Vthrs_Comp798270787279
Unbumped000000
Dead000000
Noisy010000
Undecoded000000
Total BAD010000

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

PLAQUETTE READY TO BE POTTED

PLAQUETTE encapsulated on 1/24/2007 by Arndt Kirk

P_2x3T_128_A-3on 1/24/2007 11:08 AM

P_2x3T_128_A-3on 1/24/2007 11:08 AM AFTER POTTING

[IMAGE] of

BAD CHANNELS COMPARISON Before/after ENCAPSULATION

ROCDEADNOISYUNDECODEDTESTDLIGHT
ROC00/00/00/00/00/0
ROC10/01/10/00/00/0
ROC20/00/00/00/00/0
ROC30/00/00/00/00/0
ROC40/00/00/00/00/0
ROC50/00/00/00/00/0

DEVICE READY FOR SHIPPING

Shipped on date 2007-01-24