Parts committed by Arndt Kirk on date 2/27/2007
Part | ID |
---|---|
BBM | BBM_124-2x3T |
VHDI | 2x3_481 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W35_XH4K3HT | 75B |
ROC1 | W35_XH4K3HT | 75A |
ROC2 | W35_XH4K3HT | 74D |
ROC3 | W36_XD4K3LT | 22A |
ROC4 | W36_XD4K3LT | 22D |
ROC5 | W36_XD4K3LT | 23A |
Inspected by Arndt Kirk on date 3/1/2007
LR_dev | 0.258 |
LL_dev | 0.261 |
FINAL COMMENT by Arndt Kirk | No assembly problems. Noticed residue on sensor (near edge) above ROC0 and ROC1 (probably residue from BBM vendor IZM processing). All wirebonds OK. ROC1 chn 1,21,35 required multiple attempts to bond to VHDI pads. |
PLAQUETTE made READY for ENCAPSULATION on 3/1/2007 by Arndt Kirk
PLAQUETTE encapsulated on 3/2/2007 by Arndt Kirk
PLAQUETTE made READY for testing on 3/2/2007 by Arndt Kirk
P_2x3T_124_Aon 3/5/2007 12:03 PM
P_2x3T_124_Aon 3/5/2007 12:03 PM
PLAQUETTE TESTED on 2007-03-05 by Joseph Clampitt
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | |
Ibias_DAC | 140 | 138 | 130 | 138 | 144 | 144 | |
Vana | 127 | 131 | 133 | 127 | 135 | 134 | |
Cal_Del | 85 | 73 | 91 | 78 | 72 | 94 | |
Vthrs_Comp | 68 | 76 | 69 | 75 | 86 | 76 | |
Unbumped | 0 | 0 | 0 | 1 | 0 | 0 | |
Dead | 0 | 0 | 0 | 0 | 0 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 0 | 0 | 0 | 1 | 0 | 0 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 115 | 120 | 115 | 130 | 140 | 100 |
Vsf | 135 | 135 | 140 | 135 | 135 | 140 |
VoffsetOp | 75 | 75 | 85 | 80 | 75 | 75 |
VIbias_PH | 105 | 100 | 100 | 100 | 100 | 100 |
Noise MAP
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED