P_2x3T_124_A

Parts committed by Arndt Kirk on date 2/27/2007

PartID
BBMBBM_124-2x3T
VHDI2x3_481

ROCROC waferLabel
ROC0W35_XH4K3HT75B
ROC1W35_XH4K3HT75A
ROC2W35_XH4K3HT74D
ROC3W36_XD4K3LT22A
ROC4W36_XD4K3LT22D
ROC5W36_XD4K3LT23A

Inspected by Arndt Kirk on date 3/1/2007
LR_dev0.258
LL_dev0.261
FINAL COMMENT by Arndt KirkNo assembly problems. Noticed residue on sensor (near edge) above ROC0 and ROC1 (probably residue from BBM vendor IZM processing). All wirebonds OK. ROC1 chn 1,21,35 required multiple attempts to bond to VHDI pads.

PLAQUETTE made READY for ENCAPSULATION on 3/1/2007 by Arndt Kirk

PLAQUETTE encapsulated on 3/2/2007 by Arndt Kirk

PLAQUETTE made READY for testing on 3/2/2007 by Arndt Kirk

P_2x3T_124_Aon 3/5/2007 12:03 PM

P_2x3T_124_Aon 3/5/2007 12:03 PM

PLAQUETTE TESTED on 2007-03-05 by Joseph Clampitt

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 46 V
Operational Voltage 86 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC140138130138144144
Vana127131133127135134
Cal_Del857391787294
Vthrs_Comp687669758676
Unbumped000100
Dead000000
Noisy000000
Undecoded000000
Total BAD000100

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe115120115130140100
Vsf135135140135135140
VoffsetOp757585807575
VIbias_PH105100100100100100

Noise MAP

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Efficiency MAP

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PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-03-06