P_2x3T_111_C

Parts committed by Bolla Gino on date 8/23/2007

PartID
BBMBBM_111-2x3T
VHDI2x3_689

ROCROC waferLabel
ROC0DWLQFTT54B
ROC1KNNGODT43D
ROC2DWLQFTT64D
ROC3DWLQFTT54A
ROC4DWLQFTT66A
ROC5DWLQFTT63B

This plaquette was reworked. Old results here

Inspected by Arndt Kirk on date 8/28/2007
LR_dev0.011
LL_dev0.008

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Arndt KirkAssembled at HALF-PRESSURE. No assembly problems. ROC0 ch 24,33,35; ROC1 ch 1; ROC2 ch 35 required multiple bond attempts to stick bonds to VHDI pads. No other wirebond problems. All wirebonds appear OK.

PLAQUETTE made READY for ENCAPSULATION on 8/28/2007 by Arndt Kirk

PLAQUETTE encapsulated on 8/28/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 8/28/2007 by Ozhan Koybasi

P_2x3T_111_Con 8/30/2007 3:25 PM

P_2x3T_111_Con 8/30/2007 3:25 PM

PLAQUETTE TESTED on 2007-08-30 by Joseph Clampitt

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IV_XML-File
Maximum Voltage 600 V
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LASER_XML-File
Depletion Voltage 46 V
Operational Voltage 86 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC156162156144164144
Vana142121159139150137
Cal_Del857888967986
Vthrs_Comp877791799186
Unbumped0297354830
Dead020010
Noisy000000
Undecoded000000
Total BAD0497354930

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
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[IMAGE] of VANA_XML-File
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[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe901509595100115
Vsf140140155140150140
VoffsetOp95551108511590
VIbias_PH105105100100100105

Noise MAP at VMAX

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Efficiency MAP

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Noise MAP at -200 V

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Efficiency MAP

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PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-09-04