P_2x3T_107

P_2x3T_107_A

Parts committed by Bolla Gino on date 12/18/2006

Part	ID
BBM	BBM_107-2x3T
VHDI	2x3_222

ROC ROC wafer Label

ROC0 W13_XX4JPAT 31D

ROC1 W13_XX4JPAT 31C

ROC2 W13_XX4JPAT 31B

ROC3 W13_XX4JPAT 35D

ROC4 W13_XX4JPAT 36A

ROC5 W13_XX4JPAT 36B

ROC	ROC wafer	Label
ROC0	W13_XX4JPAT	31D
ROC1	W13_XX4JPAT	31C
ROC2	W13_XX4JPAT	31B
ROC3	W13_XX4JPAT	35D
ROC4	W13_XX4JPAT	36A
ROC5	W13_XX4JPAT	36B

Inspected by Lockwood Gale on date 12/20/2006

LR_dev 0.032

LL_dev 0.045

FINAL COMMENT by Lockwood Gale No assembly problems. No problems wirebonding.

PLAQUETTE made READY for testing on 12/20/2006 by Lockwood Gale

P_2x3T_107_Aon 12/21/2006 11:02 AM

PLAQUETTE TESTED on 2006-12-21 by Gino Bolla

IV_XML-File

Maximum Voltage 600 V

LASER_XML-File

Depletion Voltage 50 V

Operational Voltage 90 V

ROC	ROC0	ROC1	ROC2	ROC3	ROC4	ROC5
Ibias_DAC	154	140	150	138	128	148
Vana	137	129	133	140	128	133
Cal_Del	72	77	70	74	92	69
Vthrs_Comp	76	75	78	71	67	78
Unbumped	0	0	0	0	0	0
Dead	0	0	0	0	0	0
Noisy	0	0	0	0	0	0
Undecoded	0	0	0	0	0	0
Total BAD	0	0	0	0	0	0

ASSEMBLY_XML-File	SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
	I_BIAS_DAC_XML-File
	VANA_XML-File
	DEAD_XML-File
	NOISY_XML-File
	UNDECODED_XML-File
	LIGHT_XML-File

PLAQUETTE READY FOR SHIPPING

PLAQUETTE encapsulated on 2007-01-11 by Arndt Kirk

P_2x3T_107_A-1on 1/15/2007 1:21 PM AFTER POTTING

Shipped on date 2007-01-15

Plaquette assigned to panel P4L_028