P_2x3T_099_A

Parts committed by Bolla Gino on date 10/20/2007

PartID
BBMBBM_099-2x3T
VHDI2x3_719

ROCROC waferLabel
ROC0W54_D2LQG4T 17C
ROC1W28_X54K5TT14C
ROC2W28_X54K5TT35A
ROC3W28_X54K5TT16A
ROC4W28_X54K5TT16B
ROC5W28_X54K5TT16D
This plaquette has been reworked. Old results

Inspected by Arndt Kirk on date 10/24/2007
PictureComment
[IMAGE] of Scratches on sensor as received from BBM vendor IZM (reworked module) between ROC0 and ROC5.

Inspected by Lockwood Gale on date 10/24/2007
LR_dev0.075
LL_dev0.074

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Lockwood GaleReworked BBM. Force used to join BBM to VHDI = 2 kg per ROC. No assembly problems. ROC 2, CH 7,8,9 1HB All wires bonded.

PLAQUETTE made READY for ENCAPSULATION on 10/24/2007 by Lockwood Gale

PLAQUETTE encapsulated on 10/24/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 10/24/2007 by Ozhan Koybasi

P_2x3T_099_Aon 10/24/2007 4:56 PM

P_2x3T_099_Aon 10/24/2007 4:56 PM

PLAQUETTE TESTED on 2007-10-24 by Ozhan Koybasi

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 44 V
Operational Voltage 84 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC148146154146144142
Vana145143130134125134
Cal_Del867371967292
Vthrs_Comp867878718170
Unbumped000000
Dead100001
Noisy000000
Undecoded000000
Total BAD100001

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe9095140100145110
Vsf145140140135140140
VoffsetOp1008575756575
VIbias_PH10510010510595100

Noise MAP at VMAX

[IMAGE] of

Efficiency MAP

[IMAGE] of

Noise MAP at -200 V

[IMAGE] of

Efficiency MAP

[IMAGE] of

PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-10-29