Parts committed by Bolla Gino on date 2/18/2008
Part | ID |
---|---|
BBM | BBM_007-2x3T |
VHDI | 2x3_412 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W53_DXLQY9T | 18B |
ROC1 | W53_DXLQY9T | 18A |
ROC2 | W53_DXLQY9T | 17B |
ROC3 | W55_D3LQE4T | 38C |
ROC4 | W55_D3LQE4T | 39A |
ROC5 | W55_D3LQE4T | 39B |
Inspected by Lockwood Gale on date 2/29/2008
LR_dev | 0.048 |
LL_dev | 0.059 |
PLAQUETTE GLUED with HALF PRESSURE
FINAL COMMENT by Lockwood Gale | Force used to join BBM to VHDI = 2.5 kg per ROC. No assembly problems. No wirebonding problems. |
PLAQUETTE made READY for ENCAPSULATION on 2/29/2008 by Lockwood Gale
PLAQUETTE encapsulated on 3/5/2008 by Ozhan Koybasi
PLAQUETTE made READY for testing on 3/5/2008 by Ozhan Koybasi
P_2x3T_007_Aon 3/6/2008 2:45 PM
P_2x3T_007_Aon 3/6/2008 2:45 PM
PLAQUETTE TESTED on 2008-03-06 by Ozhan Koybasi
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | |
Ibias_DAC | 154 | 160 | 152 | 158 | 160 | 154 | |
Vana | 144 | 134 | 142 | 130 | 130 | 138 | |
Cal_Del | 92 | 84 | 81 | 97 | 81 | 89 | |
Vthrs_Comp | 79 | 87 | 86 | 71 | 91 | 83 | |
Unbumped | 0 | 1 | 32 | 0 | 0 | 0 | |
Dead | 1 | 0 | 0 | 0 | 0 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 1 | 1 | 32 | 0 | 0 | 0 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 95 | 105 | 105 | 105 | 115 | 105 |
Vsf | 145 | 140 | 140 | 140 | 140 | 140 |
VoffsetOp | 95 | 120 | 100 | 90 | 105 | 100 |
VIbias_PH | 105 | 100 | 105 | 100 | 100 | 100 |
Noise MAP at VMAX
Efficiency MAP
Noise MAP at -200 V
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED