P_2x3T_007_A

Parts committed by Bolla Gino on date 2/18/2008

PartID
BBMBBM_007-2x3T
VHDI2x3_412

ROCROC waferLabel
ROC0W53_DXLQY9T18B
ROC1W53_DXLQY9T18A
ROC2W53_DXLQY9T17B
ROC3W55_D3LQE4T38C
ROC4W55_D3LQE4T39A
ROC5W55_D3LQE4T39B

Inspected by Lockwood Gale on date 2/29/2008
LR_dev0.048
LL_dev0.059

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Lockwood GaleForce used to join BBM to VHDI = 2.5 kg per ROC. No assembly problems. No wirebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 2/29/2008 by Lockwood Gale

PLAQUETTE encapsulated on 3/5/2008 by Ozhan Koybasi

PLAQUETTE made READY for testing on 3/5/2008 by Ozhan Koybasi

P_2x3T_007_Aon 3/6/2008 2:45 PM

P_2x3T_007_Aon 3/6/2008 2:45 PM

PLAQUETTE TESTED on 2008-03-06 by Ozhan Koybasi

[IMAGE] of
IV_XML-File
Maximum Voltage 590 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 50 V
Operational Voltage 90 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC154160152158160154
Vana144134142130130138
Cal_Del928481978189
Vthrs_Comp798786719183
Unbumped0132000
Dead100000
Noisy000000
Undecoded000000
Total BAD1132000

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe95105105105115105
Vsf145140140140140140
VoffsetOp9512010090105100
VIbias_PH105100105100100100

Noise MAP at VMAX

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Efficiency MAP

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Noise MAP at -200 V

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Efficiency MAP

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PLAQUETTE READY TO BE SHIPPED

Shipped on date 2008-03-07