P_2x3B_147_A

Parts committed by Bolla Gino on date 1/19/2007

PartID
BBMBBM_147-2x3B
VHDI2x3_394

ROCROC waferLabel
ROC0W30_X74K5RT55C
ROC1W30_X74K5RT55A
ROC2W30_X74K5RT54D
ROC3W30_X74K5RT49B
ROC4W30_X74K5RT49C
ROC5W30_X74K5RT30A

Inspected by Arndt Kirk on date 2/1/2007
LR_dev0.100
LL_dev0.098
FINAL COMMENT by Arndt KirkFailed to release vacuum on sensor. No wirebond problem.

PLAQUETTE made READY for testing on 2/1/2007 by Arndt Kirk

P_2x3B_147_Aon 2/1/2007 4:01 PM

P_2x3B_147_Aon 2/1/2007 4:01 PM

PLAQUETTE TESTED on 2007-02-01 by Isaac Childres

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 50 V
Operational Voltage 90 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC146144142142148142
Vana144143130130145127
Cal_Del808485707272
Vthrs_Comp788386908986
Unbumped000000
Dead001100
Noisy000000
Undecoded000000
Total BAD001100

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

PLAQUETTE READY TO BE POTTED

PLAQUETTE encapsulated on 2/5/2007 by Arndt Kirk

P_2x3B_147_A-1on 2/6/2007 1:21 PM

P_2x3B_147_A-1on 2/6/2007 1:21 PM AFTER POTTING

[IMAGE] of

BAD CHANNELS COMPARISON Before/after ENCAPSULATION

ROCDEADNOISYUNDECODEDTESTDLIGHT
ROC00/00/00/00/00/0
ROC10/00/00/00/00/0
ROC21/10/00/00/00/0
ROC31/10/00/00/00/0
ROC40/00/00/00/00/0
ROC50/00/00/00/00/0

DEVICE READY FOR SHIPPING

Shipped on date 2007-02-08

Plaquette assigned to panel P4R_015