P_2x3B_124_A

Parts committed by Bolla Gino on date 3/22/2007

PartID
BBMBBM_124-2x3B
VHDI2x3_503

ROCROC waferLabel
ROC0W35_XH4K3HT64A
ROC1W35_XH4K3HT63D
ROC2W35_XH4K3HT63B
ROC3W36_XD4K3LT24C
ROC4W36_XD4K3LT24D
ROC5W36_XD4K3LT25A

Inspected by Lockwood Gale on date 3/27/2007
LR_dev0.026
LL_dev0.056
FINAL COMMENT by Lockwood GaleNo assembly problems. No wirebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 3/27/2007 by Lockwood Gale

Inspected by Arndt Kirk on date 3/27/2007
PictureComment
[IMAGE] of Vacuum was inadequate on wirebonder workholder during initial attempt to bond sensor bias wirebond. Plaquette cassette moved and bond foot was stuck to sensor p-side near bias bond pad at HDI wirebond pad end of plaquette. Bond foot was wiped with clean swab to remove tail of bond.

PLAQUETTE encapsulated on 3/28/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 3/28/2007 by Ozhan Koybasi

P_2x3B_124_Aon 3/29/2007 10:59 AM

P_2x3B_124_Aon 3/29/2007 10:59 AM

PLAQUETTE TESTED on 2007-03-29 by Joseph Clampitt

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 48 V
Operational Voltage 88 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC140120134140142130
Vana140125129132138139
Cal_Del8585799410091
Vthrs_Comp888482747173
Unbumped000000
Dead000000
Noisy000000
Undecoded000000
Total BAD000000

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe10012513095115135
Vsf140140135140140140
VoffsetOp958075907585
VIbias_PH100100100105100100

Noise MAP

[IMAGE] of

Efficiency MAP

[IMAGE] of

PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-03-29

Plaquette assigned to panel P3L_036