Parts committed by Bolla Gino on date 11/19/2007
Part | ID |
---|---|
BBM | BBM_103-2x3B |
VHDI | 2x3_755 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W55_D3LQE4T | 16B |
ROC1 | W55_D3LQE4T | 16A |
ROC2 | W55_D3LQE4T | 15C |
ROC3 | W52_DOLQC8T | 25C |
ROC4 | W52_DOLQC8T | 26A |
ROC5 | W52_DOLQC8T | 26C |
Inspected by Lockwood Gale on date 12/5/2007
LR_dev | 0.051 |
LL_dev | 0.047 |
PLAQUETTE GLUED with HALF PRESSURE
FINAL COMMENT by Lockwood Gale | Force used to join BBM to VHDI = 2.5 kg per ROC. No assembly problems. ROC 1, Ch 34, 2FL, 2 tries, No other wirebonding problems. |
PLAQUETTE made READY for ENCAPSULATION on 12/5/2007 by Lockwood Gale
PLAQUETTE encapsulated on 12/7/2007 by Ozhan Koybasi
PLAQUETTE made READY for testing on 12/7/2007 by Ozhan Koybasi
P_2x3B_103_Aon 12/10/2007 11:32 AM
P_2x3B_103_Aon 12/10/2007 11:32 AM
PLAQUETTE TESTED on 2007-12-10 by Gino Bolla
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | |
Ibias_DAC | 142 | 162 | 164 | 162 | 140 | 142 | |
Vana | 150 | 147 | 159 | 149 | 144 | 143 | |
Cal_Del | 81 | 86 | 94 | 89 | 75 | 90 | |
Vthrs_Comp | 84 | 90 | 93 | 88 | 86 | 82 | |
Unbumped | 0 | 0 | 0 | 0 | 0 | 0 | |
Dead | 0 | 0 | 0 | 0 | 2 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 0 | 0 | 0 | 0 | 2 | 0 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 100 | 95 | 115 | 95 | 185 | 185 |
Vsf | 150 | 145 | 160 | 145 | 145 | 145 |
VoffsetOp | 110 | 105 | 90 | 85 | 60 | 60 |
VIbias_PH | 100 | 215 | 110 | 45 | 50 | 50 |
Noise MAP at VMAX
Efficiency MAP
Noise MAP at -200 V
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED