P_2x3B_091_A

Parts committed by Bolla Gino on date 10/20/2007

PartID
BBMBBM_091-2x3B
VHDI2x3_718

ROCROC waferLabel
ROC0W54_D2LQG4T26A
ROC1W19_XN4K38T06C
ROC2W19_XN4K38T68C
ROC3W19_XN4K38T23D
ROC4W19_XN4K38T24B
ROC5W19_XN4K38T25B
This plaquette has been reworked. Old results

Inspected by Lockwood Gale on date 10/23/2007
LR_dev0.076
LL_dev0.064

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Lockwood GaleReworked BBM. Force used to join BBM to VHDI = 1.5 kg per ROC. No assembly problems. ROC 4, CH 11, wo, ROC 4 CH 18 1hb, ROC 3 Ch 3,17 wo bonded on second try, all wires bonded.

PLAQUETTE made READY for ENCAPSULATION on 10/23/2007 by Lockwood Gale

PLAQUETTE encapsulated on 10/23/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 10/23/2007 by Ozhan Koybasi

P_2x3B_091_Aon 10/23/2007 5:20 PM

P_2x3B_091_Aon 10/23/2007 5:20 PM

PLAQUETTE TESTED on 2007-10-23 by Ozhan Koybasi

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
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LASER_XML-File
Depletion Voltage 48 V
Operational Voltage 88 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC150148154150156162
Vana139130132127117134
Cal_Del7675871018680
Vthrs_Comp907869676986
Unbumped000000
Dead220020
Noisy000000
Undecoded000000
Total BAD220020

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe9514595120150110
Vsf145135140140145140
VoffsetOp11090656575105
VIbias_PH100105100105100105

Noise MAP at VMAX

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Efficiency MAP

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Noise MAP at -200 V

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Efficiency MAP

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PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-10-29