P_2x3B_075

P_2x3B_075_C

Parts committed by Bolla Gino on date 1/24/2007

Part	ID
BBM	BBM_075-2x3B
VHDI	2x3_402

ROC ROC wafer Label

ROC0 XE4K3KT 61C

ROC1 XE4K3KT 61D

ROC2 XE4K3KT 58A

ROC3 XE4K3KT 43A

ROC4 XE4K3KT 51C

ROC5 XE4K3KT 55A

ROC	ROC wafer	Label
ROC0	XE4K3KT	61C
ROC1	XE4K3KT	61D
ROC2	XE4K3KT	58A
ROC3	XE4K3KT	43A
ROC4	XE4K3KT	51C
ROC5	XE4K3KT	55A

Inspected by Arndt Kirk on date 1/30/2007

LR_dev 0.089

LL_dev 0.088

FINAL COMMENT by Arndt Kirk No assembly problems. No wirebond problem.

PLAQUETTE made READY for testing on 1/30/2007 by Arndt Kirk

P_2x3B_075_Con 1/30/2007 4:27 PM

PLAQUETTE TESTED on 2007-01-30 by Gino Bolla

IV_XML-File

Maximum Voltage 600 V

LASER_XML-File

Depletion Voltage 50 V

Operational Voltage 90 V

ROC	ROC0	ROC1	ROC2	ROC3	ROC4	ROC5
Ibias_DAC	144	134	146	144	128	128
Vana	123	127	141	131	115	127
Cal_Del	92	73	69	77	102	78
Vthrs_Comp	74	76	83	79	77	73
Unbumped	0	1	2	0	0	0
Dead	0	0	0	0	0	0
Noisy	0	0	0	0	0	0
Undecoded	0	0	0	0	0	0
Total BAD	0	1	2	0	0	0

ASSEMBLY_XML-File	SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
	I_BIAS_DAC_XML-File
	VANA_XML-File
	DEAD_XML-File
	NOISY_XML-File
	UNDECODED_XML-File
	LIGHT_XML-File

PLAQUETTE READY TO BE POTTED

PLAQUETTE encapsulated on 1/31/2007 by Arndt Kirk

P_2x3B_075_C-1on 1/31/2007 3:55 PM

P_2x3B_075_C-1on 1/31/2007 3:55 PM AFTER POTTING

BAD CHANNELS COMPARISON Before/after ENCAPSULATION

ROC DEAD NOISY UNDECODED TESTD LIGHT

ROC0 0/0 0/0 0/0 1/0 0/0

ROC1 0/0 0/0 0/0 1/1 1/1

ROC2 0/0 0/0 0/0 0/2 2/2

ROC3 0/0 0/0 0/0 0/2 0/0

ROC4 0/0 0/0 0/0 0/1 0/0

ROC5 0/0 0/0 0/0 2/0 0/0

DEVICE READY FOR SHIPPING

Shipped on date 2007-02-01

Plaquette assigned to panel P3L_020