P_2x3B_069_A

Parts committed by Bolla Gino on date 11/19/2007

PartID
BBMBBM_069-2x3B
VHDI2x3_752

ROCROC waferLabel
ROC0W52_D0LQC8T03B
ROC1W52_D0LQC8T03A
ROC2W52_D0LQC8T18C
ROC3W52_D0LQC8T25A
ROC4W52_D0LQC8T14B
ROC5W52_D0LQC8T14C

Inspected by Lockwood Gale on date 11/30/2007
LR_dev0.069
LL_dev0.066

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Lockwood GaleForce used to join BBM to VHDI = 2.5 kg per ROC. No assembly problems. Irregular shape, stepped VHDI pads for HDI-to-VHDI wirebonds. Consider leveling these pads on VHDI before final bonds to HDI are made. No other wirebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 11/30/2007 by Lockwood Gale

Inspected by Arndt Kirk on date 12/4/2007
PictureComment
[IMAGE] of Irregular shape, stepped VHDI pads for HDI-to-VHDI wirebonds. Difficult to target bonds on flat area of pads. Consider leveling these pads on VHDI before final bonds to HDI are made.

PLAQUETTE encapsulated on 12/4/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 12/4/2007 by Ozhan Koybasi

P_2x3B_069_Aon 12/5/2007 4:12 PM

P_2x3B_069_Aon 12/5/2007 4:12 PM

PLAQUETTE TESTED on 2007-12-05 by Ozhan Koybasi

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 48 V
Operational Voltage 88 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC156140146154148148
Vana147131151151144128
Cal_Del979079838797
Vthrs_Comp888690848182
Unbumped000000
Dead000000
Noisy000000
Undecoded000000
Total BAD000000

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe10010010595100130
Vsf145135150145145135
VoffsetOp12510010511010590
VIbias_PH951009510095100

Noise MAP at VMAX

[IMAGE] of

Efficiency MAP

[IMAGE] of

Noise MAP at -200 V

[IMAGE] of

Efficiency MAP

[IMAGE] of

PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-12-08