Sensor: S_2x3B_06, Data for leakage current measurement , and plot on overall it is a GOOD sensor
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W52_D0LQC8T | 03B |
ROC1 | W52_D0LQC8T | 03A |
ROC2 | W52_D0LQC8T | 18C |
ROC3 | W52_D0LQC8T | 25A |
ROC4 | W52_D0LQC8T | 14B |
ROC5 | W52_D0LQC8T | 14C |
Inspected by Lockwood Gale on date 11/30/2007
LR_dev | 0.069 |
LL_dev | 0.066 |
PLAQUETTE GLUED with HALF PRESSURE
FINAL COMMENT by Lockwood Gale | Force used to join BBM to VHDI = 2.5 kg per ROC. No assembly problems. Irregular shape, stepped VHDI pads for HDI-to-VHDI wirebonds. Consider leveling these pads on VHDI before final bonds to HDI are made. No other wirebonding problems. |
PLAQUETTE made READY for ENCAPSULATION on 11/30/2007 by Lockwood Gale
Inspected by Arndt Kirk on date 12/4/2007
Picture | Comment |
---|---|
Irregular shape, stepped VHDI pads for HDI-to-VHDI wirebonds. Difficult to target bonds on flat area of pads. Consider leveling these pads on VHDI before final bonds to HDI are made. |
Ibias_DAC, Ibias_DAC Data | 156 | 140 | 146 | 154 | 148 | 148 |
Vana, VanaData | 147 | 131 | 151 | 151 | 144 | 128 |
CalDelData and plots | 97 | 90 | 79 | 83 | 87 | 97 |
VthrCompData and plots | 88 | 86 | 90 | 84 | 81 | 82 | Depletion Voltage is -48 and suggested operational voltage is -88
TestDdata ,TestD Plots | 2 | 1 | 0 | 7 | 0 | 2 |
LightData ,Light Plots | 0 | 0 | 0 | 0 | 0 | 0 |
Pass/Fail TestD | GOOD | GOOD | GOOD | GOOD | GOOD | GOOD |
Pass/Fail LIGHT | GOOD | GOOD | GOOD | GOOD | GOOD | GOOD |
Noise MAP at VMAX
Efficiency MAP
EXTRA DACs for NOISE
VHldDe | 100 | 100 | 105 | 95 | 100 | 130 |
Vsf | 145 | 135 | 150 | 145 | 145 | 135 |
VoffsetOp | 125 | 100 | 105 | 110 | 105 | 90 |
VIbias_PH | 95 | 100 | 95 | 100 | 95 | 100 |
Comment (if any):
This Device have been tested 0Times prior to this one and here are the links to the previous tests:End testing time: 4:40 PM