P_2x3B_035_A

Parts committed by Bolla Gino on date 11/8/2007

PartID
BBMBBM_035-2x3B
VHDI2x3_734

ROCROC waferLabel
ROC0W55_D3LQE4T42A
ROC1W55_D3LQE4T41C
ROC2W55_D3LQE4T40B
ROC3W55_D3LQE4T37D
ROC4W55_D3LQE4T38A
ROC5W55_D3LQE4T38B

Inspected by Arndt Kirk on date 11/9/2007
LR_dev0.042
LL_dev0.035

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Arndt KirkForce used to join BBM to VHDI = 2 kg per ROC. No assembly problems. Irregular VHDI pads for ROC wirebonds. No wirebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 11/9/2007 by Arndt Kirk

PLAQUETTE encapsulated on 11/9/2007 by Lockwood Gale

PLAQUETTE made READY for testing on 11/9/2007 by Lockwood Gale

P_2x3B_035_Aon 11/9/2007 1:35 PM

P_2x3B_035_Aon 11/9/2007 1:35 PM

PLAQUETTE TESTED on 2007-11-09 by Gino Bolla

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 44 V
Operational Voltage 84 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC160154166146146144
Vana149137150142142144
Cal_Del8410283987881
Vthrs_Comp887784828888
Unbumped000000
Dead103500
Noisy000000
Undecoded000000
Total BAD103500

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe95951008510595
Vsf150140155145140150
VoffsetOp1159513080100105
VIbias_PH95105100100100100

Noise MAP at VMAX

[IMAGE] of

Efficiency MAP

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Noise MAP at -200 V

[IMAGE] of

Efficiency MAP

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PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-11-09