Parts committed by Bolla Gino on date 11/8/2007
Part | ID |
---|---|
BBM | BBM_035-2x3B |
VHDI | 2x3_734 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W55_D3LQE4T | 42A |
ROC1 | W55_D3LQE4T | 41C |
ROC2 | W55_D3LQE4T | 40B |
ROC3 | W55_D3LQE4T | 37D |
ROC4 | W55_D3LQE4T | 38A |
ROC5 | W55_D3LQE4T | 38B |
Inspected by Arndt Kirk on date 11/9/2007
LR_dev | 0.042 |
LL_dev | 0.035 |
PLAQUETTE GLUED with HALF PRESSURE
FINAL COMMENT by Arndt Kirk | Force used to join BBM to VHDI = 2 kg per ROC. No assembly problems. Irregular VHDI pads for ROC wirebonds. No wirebonding problems. |
PLAQUETTE made READY for ENCAPSULATION on 11/9/2007 by Arndt Kirk
PLAQUETTE encapsulated on 11/9/2007 by Lockwood Gale
PLAQUETTE made READY for testing on 11/9/2007 by Lockwood Gale
P_2x3B_035_Aon 11/9/2007 1:35 PM
P_2x3B_035_Aon 11/9/2007 1:35 PM
PLAQUETTE TESTED on 2007-11-09 by Gino Bolla
|
||||
|
ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | |
Ibias_DAC | 160 | 154 | 166 | 146 | 146 | 144 | |
Vana | 149 | 137 | 150 | 142 | 142 | 144 | |
Cal_Del | 84 | 102 | 83 | 98 | 78 | 81 | |
Vthrs_Comp | 88 | 77 | 84 | 82 | 88 | 88 | |
Unbumped | 0 | 0 | 0 | 0 | 0 | 0 | |
Dead | 1 | 0 | 3 | 5 | 0 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 1 | 0 | 3 | 5 | 0 | 0 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 95 | 95 | 100 | 85 | 105 | 95 |
Vsf | 150 | 140 | 155 | 145 | 140 | 150 |
VoffsetOp | 115 | 95 | 130 | 80 | 100 | 105 |
VIbias_PH | 95 | 105 | 100 | 100 | 100 | 100 |
Noise MAP at VMAX
Efficiency MAP
Noise MAP at -200 V
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED