P_2x3B_007_A

Parts committed by Bolla Gino on date 2/18/2008

PartID
BBMBBM_007-2x3B
VHDI2x3_411

ROCROC waferLabel
ROC0W52_D0LQC8T04A
ROC1W52_D0LQC8T03D
ROC2W52_D0LQC8T23B
ROC3W52_D0LQC8T16A
ROC4W52_D0LQC8T56A
ROC5W52_D0LQC8T56B

Inspected by Lockwood Gale on date 2/27/2008
LR_dev0.060
LL_dev0.062

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Lockwood GaleForce used to join BBM to VHDI = 2.5 kg per ROC. No assembly problems. ROC 3, Ch 2, 2FL, 2 tries, No wirebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 2/27/2008 by Lockwood Gale

PLAQUETTE encapsulated on 2/28/2008 by Ozhan Koybasi

PLAQUETTE made READY for testing on 2/28/2008 by Ozhan Koybasi

P_2x3B_007_Aon 2/28/2008 3:56 PM

P_2x3B_007_Aon 2/28/2008 3:56 PM

PLAQUETTE TESTED on 2008-02-28 by Ozhan Koybasi

[IMAGE] of
IV_XML-File
Maximum Voltage 460 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 46 V
Operational Voltage 86 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC138142146146162160
Vana137134149141145135
Cal_Del949578757287
Vthrs_Comp758190889188
Unbumped000100
Dead000011
Noisy000000
Undecoded000000
Total BAD000111

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe10013595100100115
Vsf140140150145145140
VoffsetOp959011011095105
VIbias_PH100100100100105100

Noise MAP at VMAX

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Efficiency MAP

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Noise MAP at -200 V

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Efficiency MAP

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PLAQUETTE READY TO BE SHIPPED

Shipped on date 2008-03-07