Parts committed by Bolla Gino on date 11/8/2007
Part | ID |
---|---|
BBM | BBM_005-2x3B |
VHDI | 2x3_730 |
ROC | ROC wafer | Label |
---|---|---|
ROC0 | W47_DXLQF5T | 38B |
ROC1 | W47_DXLQF5T | 37D |
ROC2 | W46_D3LQC5T | 05B |
ROC3 | W55_D3LQE4T | 75A |
ROC4 | W55_D3LQE4T | 75B |
ROC5 | W55_D3LQE4T | 75C |
Inspected by Arndt Kirk on date 11/9/2007
LR_dev | 0.050 |
LL_dev | 0.052 |
PLAQUETTE GLUED with HALF PRESSURE
FINAL COMMENT by Arndt Kirk | Force used to join BBM to VHDI = 2 kg per ROC. No assembly problems. Irregular VHDI pads for ROC wirebonds. ROC3 ch 35 2FL scraped VHDI pad 5 tries, no other wirebonding problems. |
PLAQUETTE made READY for ENCAPSULATION on 11/9/2007 by Arndt Kirk
PLAQUETTE encapsulated on 11/9/2007 by Lockwood Gale
PLAQUETTE made READY for testing on 11/9/2007 by Lockwood Gale
P_2x3B_005_Aon 11/9/2007 1:03 PM
P_2x3B_005_Aon 11/9/2007 1:03 PM
PLAQUETTE TESTED on 2007-11-09 by Ozhan Koybasi
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ROC | ROC0 | ROC1 | ROC2 | ROC3 | ROC4 | ROC5 | |
Ibias_DAC | 162 | 158 | 148 | 148 | 154 | 162 | |
Vana | 144 | 147 | 133 | 130 | 144 | 149 | |
Cal_Del | 80 | 92 | 104 | 96 | 94 | 80 | |
Vthrs_Comp | 90 | 83 | 69 | 80 | 80 | 94 | |
Unbumped | 0 | 0 | 0 | 0 | 0 | 0 | |
Dead | 0 | 1 | 0 | 0 | 0 | 0 | |
Noisy | 0 | 0 | 0 | 0 | 0 | 0 | |
Undecoded | 0 | 0 | 0 | 0 | 0 | 0 | |
Total BAD | 0 | 1 | 0 | 0 | 0 | 0 |
ASSEMBLY_XML-File | SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File |
I_BIAS_DAC_XML-File | |
VANA_XML-File | |
DEAD_XML-File | |
NOISY_XML-File | |
UNDECODED_XML-File | |
LIGHT_XML-File |
EXTRA DACs for NOISE
VHldDe | 100 | 95 | 100 | 110 | 100 | 95 |
Vsf | 145 | 145 | 140 | 140 | 150 | 145 |
VoffsetOp | 110 | 105 | 105 | 90 | 95 | 95 |
VIbias_PH | 100 | 100 | 100 | 95 | 100 | 100 |
Noise MAP at VMAX
Efficiency MAP
Noise MAP at -200 V
Efficiency MAP
PLAQUETTE READY TO BE SHIPPED