P_2x3B_005_A

Parts committed by Bolla Gino on date 11/8/2007

PartID
BBMBBM_005-2x3B
VHDI2x3_730

ROCROC waferLabel
ROC0W47_DXLQF5T38B
ROC1W47_DXLQF5T37D
ROC2W46_D3LQC5T05B
ROC3W55_D3LQE4T75A
ROC4W55_D3LQE4T75B
ROC5W55_D3LQE4T75C

Inspected by Arndt Kirk on date 11/9/2007
LR_dev0.050
LL_dev0.052

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Arndt KirkForce used to join BBM to VHDI = 2 kg per ROC. No assembly problems. Irregular VHDI pads for ROC wirebonds. ROC3 ch 35 2FL scraped VHDI pad 5 tries, no other wirebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 11/9/2007 by Arndt Kirk

PLAQUETTE encapsulated on 11/9/2007 by Lockwood Gale

PLAQUETTE made READY for testing on 11/9/2007 by Lockwood Gale

P_2x3B_005_Aon 11/9/2007 1:03 PM

P_2x3B_005_Aon 11/9/2007 1:03 PM

PLAQUETTE TESTED on 2007-11-09 by Ozhan Koybasi

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
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LASER_XML-File
Depletion Voltage 46 V
Operational Voltage 86 V

ROCROC0ROC1ROC2ROC3ROC4ROC5
Ibias_DAC162158148148154162
Vana144147133130144149
Cal_Del8092104969480
Vthrs_Comp908369808094
Unbumped000000
Dead010000
Noisy000000
Undecoded000000
Total BAD010000

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe1009510011010095
Vsf145145140140150145
VoffsetOp110105105909595
VIbias_PH10010010095100100

Noise MAP at VMAX

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Efficiency MAP

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Noise MAP at -200 V

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Efficiency MAP

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PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-11-09