P_1x5R_135

P_1x5R_135_A

Parts committed by Bolla Gino on date 3/21/2007

Part	ID
BBM	BBM_135-1x5
VHDI	1x5R_255

ROC ROC wafer Label

ROC0 W36_XD4K3LT 37A

ROC1 W36_XD4K3LT 36C

ROC2 W36_XD4K3LT 36B

ROC3 W36_XD4K3LT 36A

ROC4 W36_XD4K3LT 35D

ROC	ROC wafer	Label
ROC0	W36_XD4K3LT	37A
ROC1	W36_XD4K3LT	36C
ROC2	W36_XD4K3LT	36B
ROC3	W36_XD4K3LT	36A
ROC4	W36_XD4K3LT	35D

Inspected by Arndt Kirk on date 3/23/2007

Picture Comment

The optical video probe on the CMM came into contact with the backside of ROC4 and broke the ROC. The CMM probe was under machine control during the initial move in the BBM alignment program when it contacted the edge of ROC4. The cause of the unintended motion of the CMM probe is unknown and being investigated. This picture is of the backside of ROC4 at the end of the break next to ROC3. ROC3 visually appears to be unaffected.

Picture	Comment
	The optical video probe on the CMM came into contact with the backside of ROC4 and broke the ROC. The CMM probe was under machine control during the initial move in the BBM alignment program when it contacted the edge of ROC4. The cause of the unintended motion of the CMM probe is unknown and being investigated. This picture is of the backside of ROC4 at the end of the break next to ROC3. ROC3 visually appears to be unaffected.

Inspected by Arndt Kirk on date 3/23/2007

Picture Comment

This picture is of the backside of ROC4 at the end of the break next to a corner of the sensor. A scratch on the sensor is visible in the picture that may or may not be due to the breakage of ROC4, otherwise the area of the n-side of the sensor that is visible appears to be unaffected.

Picture	Comment
	This picture is of the backside of ROC4 at the end of the break next to a corner of the sensor. A scratch on the sensor is visible in the picture that may or may not be due to the breakage of ROC4, otherwise the area of the n-side of the sensor that is visible appears to be unaffected.

Inspected by Arndt Kirk on date 4/9/2007

Picture Comment

Cracks through the sensor in the same corner of the BBM (above the broken edge of ROC4 with wirebond pads).

Picture	Comment
	Cracks through the sensor in the same corner of the BBM (above the broken edge of ROC4 with wirebond pads).

Inspected by Arndt Kirk on date 4/17/2007

LR_dev NA

LL_dev NA

PLAQUETTE GLUED with MINIMUM PRESSURE

FINAL COMMENT by Arndt Kirk

BBM_135-1x5 broken during alignment, so this BBM was used with VHDI 1x5R_255 to build a "broken" plaquette "by hand" for electrical testing. This BBM is attached to the VHDI with 3 “glue dots” (one dot each between ROCs 0, 1, and 3, and the VHDI). This plaquette was used for a 1mm ROC-to-VHDI wire bond length trial. ROCs 0-3 are wirebonded to the VHDI pads and there are wirebonds on the VHDI to bypass ROC4. There is a wirebond for biasing the cracked sensor.

PLAQUETTE made READY for ENCAPSULATION on 4/17/2007 by Arndt Kirk

P_1x5R_135_Aon 4/17/2007 1:33 PM

PLAQUETTE TESTED on 2007-04-17 by Gino Bolla

IV_XML-File

Maximum Voltage 40 V

LASER_XML-File

Depletion Voltage 96 V

Operational Voltage 136 V

ROC	ROC0	ROC1	ROC2	ROC3	ROC4
Ibias_DAC	146	138	126	130	290
Vana	149	125	131	254	254
Cal_Del	85	78	80	0	0
Vthrs_Comp	85	76	74	0	0
Unbumped	0	0	0	0	0
Dead	17	23	21	0	0
Noisy	0	0	0	0	0
Undecoded	0	0	0	0	0
Total BAD	17	23	21	0	0

ASSEMBLY_XML-File	SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
	I_BIAS_DAC_XML-File
	VANA_XML-File
	DEAD_XML-File
	NOISY_XML-File
	UNDECODED_XML-File
	LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe	85	120	125
Vsf	145	135	135
VoffsetOp	120	90	80
VIbias_PH	100	100	95

Noise MAP

Efficiency MAP

PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-07-05