P_1x5R_069_A

Parts committed by Bolla Gino on date 11/19/2007

PartID
BBMBBM_069-1x5
VHDI1x5R_543

ROCROC waferLabel
ROC0W52_D0LQC8T18A
ROC1W52_D0LQC8T17D
ROC2W52_D0LQC8T17A
ROC3W52_D0LQC8T16C
ROC4W52_D0LQC8T03C

Inspected by Lockwood Gale on date 11/30/2007
LR_dev0.046
LL_dev0.039

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Lockwood GaleForce used to join BBM to VHDI = 2 kg per ROC. No assembly problems. No wirebonding problems.

PLAQUETTE made READY for ENCAPSULATION on 11/30/2007 by Lockwood Gale

PLAQUETTE encapsulated on 12/4/2007 by Ozhan Koybasi

PLAQUETTE made READY for testing on 12/4/2007 by Ozhan Koybasi

P_1x5R_069_Aon 12/5/2007 1:33 PM

P_1x5R_069_Aon 12/5/2007 1:33 PM

PLAQUETTE TESTED on 2007-12-05 by Ozhan Koybasi

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 52 V
Operational Voltage 92 V

ROCROC0ROC1ROC2ROC3ROC4
Ibias_DAC156160148140156
Vana149154156138147
Cal_Del9180909279
Vthrs_Comp8490918888
Unbumped00000
Dead1511000
Noisy00000
Undecoded00000
Total BAD1511000

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe9010095100100
Vsf150150155140145
VoffsetOp10512513095110
VIbias_PH100100100100110

Noise MAP at VMAX

[IMAGE] of

Efficiency MAP

[IMAGE] of

Noise MAP at -200 V

[IMAGE] of

Efficiency MAP

[IMAGE] of

PLAQUETTE READY TO BE SHIPPED

Inspected by Arndt Kirk on date 12/7/2007
PictureComment
[IMAGE] of ROC0 and ROC1 wirebonds damaged during visual inspection after first round of electrical tests on 12/5/07. Original ROC0 and ROC1 wirebonds and encapsulant were pulled and redone before retesting. Picture shows some of the new ROC0 wirebonds and encapsulant beads.

P_1x5R_069_A-1on 12/7/2007 3:23 PM

P_1x5R_069_A-1on 12/7/2007 3:23 PM

Shipped on date 2007-12-08