P_1x2R_162_C

Parts committed by Arndt Kirk on date 5/3/2007

PartID
BBMBBM_162-1x2T
VHDI1x2R_259

ROCROC waferLabel
ROC0KNN0GDT24D
ROC1KNN0GDT14B

Inspected by Arndt Kirk on date 5/7/2007
LR_dev0.062
LL_dev0.051

PLAQUETTE GLUED with HALF PRESSURE

FINAL COMMENT by Arndt KirkAssembled at HALF-PRESSURE. No assembly problems. No wirebond problems.

PLAQUETTE made READY for ENCAPSULATION on 5/7/2007 by Arndt Kirk

PLAQUETTE encapsulated on 5/8/2007 by Arndt Kirk

PLAQUETTE made READY for testing on 5/8/2007 by Arndt Kirk

P_1x2R_162_Con 5/8/2007 1:22 PM

P_1x2R_162_Con 5/8/2007 1:22 PM

PLAQUETTE TESTED on 2007-05-08 by mia tosi

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 46 V
Operational Voltage 86 V

ROCROC0ROC1
Ibias_DAC144148
Vana143141
Cal_Del6271
Vthrs_Comp8585
Unbumped00
Dead11
Noisy00
Undecoded00
Total BAD11

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

EXTRA DACs for NOISE

VHldDe8595
Vsf145140
VoffsetOp9580
VIbias_PH100100

Noise MAP

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Efficiency MAP

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PLAQUETTE READY TO BE SHIPPED

Shipped on date 2007-05-11