P_1x2R_028_C

Parts committed by Bolla Gino on date 2/5/2007

PartID
BBMBBM_028-1x2T
VHDI1x2R_268

ROCROC waferLabel
ROC0XE4K3KT48A
ROC1XE4K3KT47B

Inspected by Arndt Kirk on date 2/8/2007
LR_dev0.088
LL_dev0.082
FINAL COMMENT by Arndt KirkNo assembly problem. No wirebond problem.

PLAQUETTE made READY for testing on 2/8/2007 by Arndt Kirk

P_1x2R_028_Con 2/8/2007 3:57 PM

P_1x2R_028_C-1on 2/8/2007 3:59 PM

P_1x2R_028_C-1on 2/8/2007 3:59 PM

PLAQUETTE TESTED on 2007-02-08 by Isaac Childres

[IMAGE] of
IV_XML-File
Maximum Voltage 600 V
[IMAGE] of
LASER_XML-File
Depletion Voltage 48 V
Operational Voltage 88 V

ROCROC0ROC1
Ibias_DAC134134
Vana121120
Cal_Del9597
Vthrs_Comp7257
Unbumped11
Dead00
Noisy00
Undecoded00
Total BAD11

ASSEMBLY_XML-File SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
[IMAGE] of I_BIAS_DAC_XML-File
[IMAGE] of VANA_XML-File
[IMAGE] of DEAD_XML-File
[IMAGE] of NOISY_XML-File
[IMAGE] of UNDECODED_XML-File
[IMAGE] of LIGHT_XML-File

Noise MAP

[IMAGE] of

Efficiency MAP

[IMAGE] of

ROC0 NOISE[IMAGE] of [IMAGE] of MEAN = 4.221127

SIGMA = 0.322499
ROC1 NOISE[IMAGE] of [IMAGE] of MEAN = 4.272498

SIGMA = 0.320124

PLAQUETTE READY TO BE POTTED

PLAQUETTE encapsulated on 2/12/2007 by Ozhan Koybasi

P_1x2R_028_C-2on 2/12/2007 1:43 PM

P_1x2R_028_C-2on 2/12/2007 1:43 PM AFTER POTTING

[IMAGE] of

BAD CHANNELS COMPARISON Before/after ENCAPSULATION

ROCDEADNOISYUNDECODEDTESTDLIGHT
ROC00/00/30/01/21/1
ROC10/00/00/00/01/1

DEVICE READY FOR SHIPPING

Shipped on date 2007-02-16

Plaquette assigned to panel P4R_050